Electronic device and method of manufacturing same
It is proposed a method of manufacturing an electronic system wherein a first substrate comprising first connection elements on a first surface of the first substrate is provided; a second substrate comprising second connection elements on a first surface of the second substrate is provided; a polymer layer is applied to at least one of the two first surfaces; the first connection elements are attached to the second connection elements; and the polymer layer is caused to swell during or after the attachment.
1. A semiconductor package comprising:
a first substrate;
a second substrate over the first substrate;
multiple connection elements between a planar surface of the first substrate and a planar surface of the second substrate for electrically connecting the first substrate with the second substrate; and
a contracted polymer layer disposed between the first substrate and the second substrate which binds the first and second substrates together and holds the multiple connection elements in mechanical contact with one another to form solderless connections between the multiple connection element that electrically connect the first substrate with the second substrate, the contracted polymer layer being the sole means binding the first substrate to the second substrate, wherein the contracted polymer layer is contained between the first and second substrates and does not extend beyond the planar surface of the second substrate in a direction extending orthogonally from the planar surface of the first substrate toward the second substrate, and wherein a sidewall of the polymer layer protrudes from the first or second surface at an angle from 55 degrees to 120 degrees.
2. The electronic system according to claim 1 wherein the connection elements extend through the polymer layer.
3. The electronic system according to claim 1 wherein the polymer layer comprises an organic compound.
4. The electronic system according to claim 1 wherein the polymer layer comprises at least one of PMMA, polycarbonate, polyimide, polyurethane, polyvinyl chloride, and epoxy.
5. The electronic system according to claim 1 wherein the polymer layer is soluble in at least one of benzene, methyl chloride, acetone, ethyl acetate, methyl acetate, alcohol, terpenes, tetrachloroethlene, toluene, turpentine, and hexane.
6. The electronic system according to claim 1 wherein the polymer layer adheres to a first surface of the first substrate and a first surface of the second substrate.
7. The electronic system according to claim 1 wherein the connection elements are arranged in an array of lines and rows.
8. The electronic system according to claim 1 wherein the polymer layer is adapted to increase in volume by more than 5 Vol. %.
9. The electronic system according to claim 1 wherein the first substrate is at least one of a semiconductor wafer, a semiconductor chip, an integrated circuit, a ceramic containing substrate, a glass containing substrate, a laminate substrate, an encapsulated semiconductor chip, a silicon carrier, and a substrate comprising metal layers.
10. The electronic system according to claim 1 wherein the second substrate is at least one of a semiconductor wafer, a semiconductor chip, an integrated circuit, a ceramic containing substrate, a glass containing substrate, a laminate substrate, an encapsulated semiconductor chip, a silicon carrier, and a substrate comprising metal layers.
11. The electronic system according to claim 1 wherein the connection elements comprise at least one of connection pads, solder bumps, pillars, and stud bumps.
12. A semiconductor package comprising:
a first substrate;
a second substrate over the first substrate;
multiple connection elements between a planar surface of the first substrate and a planar surface of the second substrate for electrically connecting the first substrate with the second substrate;
a contracted polymer layer between the first substrate and the second substrate, the contracted polymer layer comprising at least one of PMMA, polycarbonate, and polyvinyl chloride, wherein the contracted polymer layer binds the first and second substrates together and holds the multiple connection elements in mechanical contact with one another to form solderless connections between the multiple connection element that electrically connect the first substrate with the second substrate, the contracted polymer layer being the sole means binding the first substrate to the second substrate, wherein the contracted polymer layer is contained between the first and second substrates and does not extend beyond the planar surface of the second substrate in a direction extending orthogonally from the planar surface of the first substrate toward the second substrate, and wherein a sidewall of the polymer layer protrudes from the first or second surface at an angle from 55 degrees to 120 degrees.
13. The electronic system according to claim 12 wherein the connection elements extend through the polymer layer.
14. The electronic system according to claim 12 wherein the polymer layer adheres to a first surface of the first substrate and a first surface of the second substrate.
15. The electronic system according to claim 12 wherein the connection elements are arranged in an array of lines and rows.
16. The electronic system according to claim 12 wherein the polymer layer is adapted to increase in volume by more than 5 Vol. %.
17. The electronic system according to claim 12 wherein the first substrate is at least one of a semiconductor wafer, a semiconductor chip, an integrated circuit, a ceramic containing substrate, a glass containing substrate, a laminate substrate, an encapsulated semiconductor chip, a silicon carrier, and a substrate comprising metal layers.
18. The electronic system according to claim 12 wherein the second substrate is at least one of a semiconductor wafer, a semiconductor chip, an integrated circuit, a ceramic containing substrate, a glass containing substrate, a laminate substrate, an encapsulated semiconductor chip, a silicon carrier, and a substrate comprising metal layers.
19. The electronic system according to claim 12 wherein the connection elements comprise at least one of connection pads, solder bumps, pillars, and stud bumps.
20. A semiconductor package comprising:
a first substrate having a first plurality of connection elements extending from a major surface;
a second substrate having a second plurality of connection elements extending from a major surface, wherein the second substrate is positioned over the first substrate so that each of the connection elements of the second plurality of connection elements aligns with a corresponding one of the connection elements of the first plurality of connection elements; and
a contracted polymer layer between the first substrate and the second substrate, wherein the contracted polymer layer binds the first and second substrates together and holds each of the connection elements of the second plurality of connection elements in mechanical contact against the corresponding one of the connection elements of the first plurality of the connection elements to form solderless connection between and the first plurality and second plurality of connection elements to electrically connect the first substrate with the second substrate, the contracted polymer layer being the sole means binding the first substrate to the second substrate, wherein the contracted polymer layer is contained between the major surfaces of the first and second substrates and does not extend beyond the major surface of the second substrate in a direction extending orthogonally from the major surface of the first substrate toward the second substrate, and wherein a sidewall of the polymer layer protrudes from the first or second surface at an angle from 55 degrees to 120 degrees.
21. The electronic system of claim 20 , wherein the connection elements comprise copper coated with a layer of gold.