Wafer level packaging integrated hydrogen getter
View Patent ↗A wafer-level package that employs one or more integrated hydrogen getters within the wafer-level package on a substrate wafer or a cover wafer. The hydrogen getters are provided between and among the integrated circuits on the substrate wafer or the cover wafer, and are deposited during the integrated circuit fabrication process. In one non-limiting embodiment, the substrate wafer is a group III-V semiconductor material, and the hydrogen getter includes a titanium layer, a nickel layer, and a palladium layer.
1. A wafer-level package comprising:
a substrate wafer;
a cover wafer mounted to the substrate wafer to form a hermetically sealed cavity;
a plurality of integrated circuits formed on the substrate wafer or the cover wafer;
a plurality of traces formed on the substrate wafer on which the plurality of integrated circuits are formed or the cover wafer on which the plurality of integrated circuits are formed; and
a plurality of hydrogen getters interspersed within and among the plurality of integrated circuits, wherein the plurality of hydrogen getters are integrated hydrogen getters formed on the substrate wafer or the cover wafer when the integrated circuits are formed on the substrate wafer or the cover wafer, and wherein the plurality of hydrogen getters include a plurality of layers formed on a parallel plane with respect to the substrate wafer or the cover wafer and wherein the plurality of hydrogen getters are formed among the plurality of traces.
2. The wafer-level package according to claim 1 , wherein the hydrogen getters include a titanium layer, a nickel layer, and a palladium layer.
3. The wafer-level package according to claim 2 wherein the hydrogen getters include a first titanium layer, a nickel layer deposited on the first titanium layer, a second titanium layer deposited on the nickel layer and a palladium layer deposited on the second titanium layer.
4. The wafer-level package according to claim 1 wherein the integrated circuits are monolithic millimeter-wave integrated circuits.
5. The wafer-level package according to claim 1 wherein the substrate wafer is a semiconductor wafer.
6. The wafer-level package according to claim 1 wherein the substrate wafer is a non-semiconductor material suitable for wafer-level packaging.
7. The wafer-level package according to claim 1 wherein the cover wafer is a semiconductor wafer.
8. The wafer-level package according to claim 1 wherein the cover wafer is a non-semiconductor material suitable for wafer-level packaging.
9. A wafer-level package comprising:
a substrate wafer;
a cover wafer mounted to the substrate wafer to form a hermetically sealed cavity;
at least one integrated circuit formed on the substrate wafer or the cover wafer;
a plurality of traces formed on the substrate wafer on which the at least one integrated circuit is formed or the cover wafer on which the at least one integrated circuit is formed; and
a plurality of hydrogen getters formed on the substrate wafer or the cover wafer when the at least one integrated circuit is formed on the substrate wafer or the cover wafer, said plurality of hydrogen getters each including a plurality of layers formed on a parallel plane with respect to the substrate wafer or the cover wafer and wherein the plurality of hydrogen getters are formed between the at least one integrated circuit and the plurality of traces.
10. The wafer-level package according to claim 9 wherein the hydrogen getters include a titanium layer, a nickel layer and a palladium layer.
11. The wafer-level package according to claim 10 wherein the hydrogen getters include a first titanium layer, a nickel layer deposited on the first titanium layer, a second titanium layer deposited on the nickel layer and a palladium layer deposited on the second titanium layer.
12. The wafer-level package according to claim 9 wherein the at least one integrated circuit is a monolithic millimeter-wave integrated circuit.