METAL TRACE FABRICATION FOR OPTICAL ELEMENT

1 . A method comprising:

creating an optical element including a surface defining a recess;

depositing conductive material on the surface such that a portion of the deposited conductive material is disposed within the recess; and

substantially planarizing the surface to expose the portion of the conductive material disposed within the recess.

2 . A method according to claim 1 , wherein substantially planarizing the surface comprises chemical-mechanical polishing the conductive material and the surface.

3 . A method according to claim 1 , wherein creating the optical element comprises molding the optical element with a mold defining the optical element and the recess.

4 . A method according to claim 1 , wherein depositing the conductive material comprises spraying molten conductive material onto the optical element.

5 . A method according to claim 4 , wherein depositing the conductive material further comprises placing a stencil on the optical element prior to spraying the molten conductive material onto the optical element.

6 . A method according to claim 1 , wherein the optical element comprises a transparent portion including the surface.

7 . A method according to claim 1 , further comprising:

depositing a reflective material on the optical element, the reflective material not being applied to the surface;

depositing an electrical isolator on the reflective material, the electrical isolator not being applied to the surface; and

depositing the conductive material on the electrical isolator.

8 . A method according to claim 7 , wherein depositing the conductive material on the electrical isolator comprises placing a stencil on the electrical isolator prior to metal spraying the conductive material onto the electrical isolator.

9 . A method according to claim 1 , further comprising;

depositing a solder mask over the exposed portion of the conductive material,

wherein the solder mask defines an aperture through which light from the optical element may pass.

10 . A method according to claim 9 , further comprising:

coupling a terminal of a solar cell to the exposed portion of the conductive material,

wherein a portion of the solar cell is disposed over the aperture.

11 . An apparatus comprising:

an optical element including a surface defining a recess;

conductive material disposed within the recess; and

a solder mask disposed over a portion of the conductive material,

wherein the solder mask defines an aperture through which light from the optical element may pass.

12 . An apparatus according to claim 11 , wherein the optical element comprises a transparent portion including the surface, and light may pass from the transparent portion through the aperture.

13 . An apparatus according to claim 11 , wherein the surface and an exposed surface of the conductive material are substantially coplanar.

14 . An apparatus according to claim 11 , further comprising:

a reflective material disposed on the optical element and not on the surface;

an electrical isolator disposed on the reflective material and not on the surface; and

second conductive material is disposed on the electrical isolator.

15 . An apparatus according to claim 11 , further comprising:

a solar cell comprising a terminal,

wherein the aperture exposes a portion of the conductive material,

wherein the terminal is coupled to the exposed portion of the conductive material, and

wherein a portion of the solar cell is disposed to receive the light from the aperture.

16 . A method comprising:

creating an optical element including a surface defining a recess;

depositing a material on areas of the surface other than the recess;

depositing conductive material on the material and within the recess; and

removing the material and any conductive material deposited thereon.

17 . A method according to claim 16 , wherein depositing the conductive material comprises spraying molten conductive material onto the optical element.

18 . A method according to claim 17 , wherein depositing the conductive material further comprises placing a stencil on the optical element prior to spraying the molten conductive material onto the optical element.

19 . A method according to claim 16 , further comprising:

depositing a reflective material on the optical element, the reflective material not being applied to the surface;

depositing an electrical isolator on the reflective material, the electrical isolator not being applied to the surface; and

depositing the conductive material on the electrical isolator.

20 . A method comprising:

depositing a conductive material on an optical element;

depositing photoresist on the conductive material;

removing a portion of the photoresist to expose a portion of the conductive material;

plating the exposed portion of the conductive material with a second conductive material;

removing a remaining portion of the photoresist; and

removing unplated portions of the conductive material.

21 . A method according to claim 20 , wherein:

the conductive material and the second conductive material are substantially similar, and

removing the unplated portions comprises etching the unplated portions and a portion of the second conductive material.

22 . A method according to claim 20 , wherein:

the conductive material and the second conductive material are different; and

removing the unplated portions comprises selectively etching the unplated portions without etching the second conductive material.