Optical apparatus
View Patent ↗An optical chassis includes a mount substrate an optoelectronic device on the mount substrate, a spacer substrate, and a sealer substrate. The mount substrate, the spacer substrate and the sealer substrate are vertically stacked and hermetically sealing the optoelectronic device. An external electrical contact for the optoelectronic device is provided outside the sealing. At least part of the optical chassis may be made on a wafer level. A passive optical element may be provided on the sealer substrate or on another substrate stacked and secured thereto.
1. An optical apparatus, comprising:
a mount substrate;
an optoelectronic device on the mount substrate;
a spacer on the mount substrate, the spacer including a hole exposing the optoelectronic device;
a cover on the spacer, the cover covering the hole, at least two of the mount substrate, the spacer and the cover together sealing the optoelectronic device; and
a metalized trench in the mount substrate, the metalized trench extending from the optoelectronic device to an edge of the mount substrate, a cross-section of the metalized trench at the edge of the mount substrate being exposed.
2. The optical apparatus as claimed in claim 1 , wherein the mount substrate and the spacer are horizontally co-extensive.
3. The optical apparatus as claimed in claim 1 , further comprising a ledge formed in the mount substrate extending beyond the spacer substrate, the metalized trench being in the ledge.
4. The optical apparatus as claimed in claim 1 , wherein the metalized trench is wider near the edge of the mount substrate and near the optoelectronic device than between the edge and the optoelectronic device.
5. An optical apparatus, comprising:
a mount substrate;
an optoelectronic device on the mount substrate;
a spacer on the mount substrate, the spacer including a hole exposing the optoelectronic device;
a cover on the spacer, the cover covering the hole, at least two of the mount substrate, the spacer and the cover together sealing the optoelectronic device;
a via extending through a bottom surface of the mount substrate, sidewalls of the via being conductive, sidewalls of the via being electrically connected to the optoelectronic device; and
a conductive structure in the via, the conductive structure contacting the sidewalls of the via.
6. The optical apparatus as claimed in claim 5 , wherein the conductive structure includes a solder ball.
7. An optical apparatus, comprising:
a mount substrate;
an optoelectronic device on the mount substrate;
a spacer on the mount substrate, the spacer including a hole exposing the optoelectronic device;
a cover on the spacer, the cover covering the hole, at least two of the mount substrate, the spacer and the cover together sealing the optoelectronic device;
a conductive material on the mount substrate and extending along at least two adjacent surfaces of the mount substrate, the conductive material being electrically connected to the optoelectronic device, wherein a first surface of the at least two adjacent surfaces is a surface on which the optoelectronic device is mounted and a second surface of the at least two adjacent surfaces is not orthogonal to the first surface.
8. The optical apparatus as claimed in claim 7 , wherein the mount substrate is ceramic.
9. The optical apparatus as claimed in claim 7 , further comprising a passive optical element on a terminal surface of the optical apparatus.
10. The optical apparatus as claimed in claim 7 , further comprising a passive alignment feature on a terminal surface of the optical apparatus.
11. The optical apparatus as claimed in claim 7 , wherein the cover has a planar surface facing the optoelectronic device.
12. The optical apparatus as claimed in claim 11 , further comprising a passive optical element on a surface of the cover opposite the planar surface.
13. An optical apparatus, comprising:
a mount substrate;
an optoelectronic device on the mount substrate;
a spacer on the mount substrate, the spacer including a hole exposing the optoelectronic device;
a cover on the spacer, the cover covering the hole, at least two of the mount substrate, the spacer and the cover together sealing the optoelectronic device;
a via extending through a bottom surface of the mount substrate, sidewalls of the via being conductive, sidewalls of the via being electrically coupled to the optoelectronic device and
a conductive structure electrically coupled to the conductive sidewalls of the via.
14. The optical apparatus as claimed in claim 13 , wherein the conductive structure includes a solder ball.