Organic light emitting display having a substrate support structure and fabricating method thereof
View Patent ↗An organic light emitting display including a substrate, a semiconductor layer formed on the substrate, an organic light emitting diode formed on the semiconductor layer, an encapsulant formed on a periphery of the substrate which is an outer periphery of the organic light emitting diode and the semiconductor layer; and an encapsulation substrate attached to the encapsulant.
1. An organic light emitting display device, comprising:
a substrate;
a support arranged on one side of said substrate, said support is stainless steel;
a bonding agent arranged on an opposite side of said substrate from that of said support and facing said support, said bonding agent is an adhesive;
a semiconductor layer arranged on the substrate;
a plurality of organic light emitting diodes (OLEDs) arranged in rows and columns in the organic light emitting display device with each of the plurality of organic light emitting diodes arranged on the semiconductor layer;
an encapsulant arranged on a periphery of the substrate corresponding to an outer periphery of each of the plurality of organic light emitting diodes and the semiconductor layer; and
an encapsulation substrate attached to the encapsulant,
wherein the support is on either side of the row of OLEDs, on either side of the column of OLEDs, or surrounding a subset of the plurality of OLEDs but more than a single OLED and less than all the OLEDs in the organic light emitting display device.
2. The organic light emitting display device as claimed in the claim 1 , wherein the support and the semiconductor layer are arranged on a same side of the substrate.
3. The organic light emitting display device as claimed in the claim 1 , wherein the support is arranged on the outer periphery of the plurality of organic light emitting diodes and the semiconductor layer.
4. The organic light emitting display device as claimed in the claim 1 , wherein the support comprises at least one of either an insulating material or a conductive material.
5. The organic light emitting display device as claimed in the claim 1 , wherein the support is thinner than the encapsulant.
6. The organic light emitting display device as claimed in the claim 1 , wherein the support is thinner than the encapsulant and the encapsulation substrate together.
7. The organic light emitting display device as claimed in the claim 1 , wherein the bonding agent is arranged near at least one side of the substrate.
8. The organic light emitting display device as claimed in the claim 1 , wherein the bonding agent is arranged on the outer periphery of the encapsulant and the encapsulation substrate.
9. The organic light emitting display device as claimed in the claim 1 , wherein the substrate is larger than a range of the encapsulation substrate.
10. The organic light emitting display device as claimed in the claim 1 , wherein the substrate has a thickness in a range of 0.05˜1 mm.
11. The organic light emitting display device as claimed in the claim 1 , wherein the substrate comprises one of a glass, a plastic, a polymer or a steel.
12. The organic light emitting display device as claimed in the claim 1 , wherein in further comprising a non-transmissive layer arranged on a side of the substrate opposite to the side thereof having the semiconductor layer arranged thereon.
13. The organic light emitting display device as claimed in the claim 1 , further comprising a non-transmissive layer having a thickness in a range of 500 Å to 3,000 Å, the non-transmissive layer being arranged on a side of the substrate opposite to the side thereof having the semiconductor layer arranged thereon.
14. The organic light emitting display device as claimed in the claim 1 , further comprising a non-transmissive layer arranged on a side of the substrate opposite to the side thereof having the semiconductor layer arranged thereon, the non-transmissive layer being one of a metal which blocks UV-rays, a transparent UV-ray protective agent, or an opaque UV-ray protective agent.
15. The organic light emitting display device as claimed in the claim 1 , further comprising a non-transmissive layer arranged on a side of the substrate opposite to a side thereof having the semiconductor layer arranged thereon, the non-transmissive layer being one of Cr, Cr 2 O 3 , Al, Au, Ag, MgO or a silver alloy.
16. The organic light emitting display device as claimed in the claim 1 , further comprising a non-transmissive layer and an anti-friction layer arranged in sequence on a side of the substrate opposite to the side thereof having the semiconductor layer arranged thereon.
17. The organic light emitting display device as claimed in the claim 16 , wherein the anti-friction layer has a thickness in a range of 10-100 μm.
18. The organic light emitting display device as claimed in the claim 16 , wherein the anti-friction layer comprises at least one of an organic material or an inorganic material.
19. The organic light emitting display device as claimed in the claim 1 , further comprising:
a buffer layer arranged on an underside surface of the semiconductor layer;
a gate insulation layer arranged on a top surface of the semiconductor layer;
a gate electrode arranged on a top surface of the gate insulation layer;
an inter-layer dielectric layer arranged on a top surface of the gate electrode;
a source/drain electrode arranged on a top surface of the inter-layer dielectric layer;
an insulation layer arranged on a top surface of the source/drain electrode; and
each of the plurality of organic light emitting diodes arranged on a top surface of the insulation layer.
20. The organic light emitting display device as claimed in the claim 1 , further comprising a driving circuit further arranged on the substrate between the outer periphery of the semiconductor layer and an inner periphery of the encapsulant.