Package for optical device and method of manufacturing the same
A package for an optical device includes a plurality of ceramic layers 101, 102 and 103 stacked on a base 2 and a recessed portion 18 formed to mount an optical element at the center. Reversely rounded portions 11 are formed on the corners of the ceramic layers 100, 101 and 102 such that at least one of the four corners of the top ceramic layer 103 has an outside shape placed outside the outside shapes of the corners of the ceramic layers 100, 101 and 102 with respect to the center.
1 . A package for an optical device, the package comprising at least two stacked plate-like members and a recessed portion formed to mount an optical element at a center,
wherein at least one of four corners of the plate-like member of a top layer has an outside shape placed, with respect to the center, outside an outside shape of a corner of the plate-like member of each layer disposed under the plate-like member of the top layer.
2 . A package for a solid-state imaging device, the package comprising at least two stacked plate-like members and a recessed portion formed to mount a solid-state imaging element at a center,
wherein at least one of four corners of the plate-like member of a top layer has an outside shape placed, with respect to the center, outside an outside shape of a corner of the plate-like member of each layer disposed under the plate-like member of the top layer.
3 . A package for an optical device, the package comprising a plurality of ceramic layers stacked on a base and a recessed portion formed to mount an optical element at a center,
wherein at least one of four corners of the top ceramic layer has an outside shape placed, with respect to the center, outside an outside shape of a corner of the ceramic layer disposed under the top ceramic layer.
4 . A package for a solid-state imaging device, the package comprising a plurality of ceramic layers stacked on a base and a recessed portion formed to mount a solid-state imaging element at a center,
wherein at least one of four corners of the top ceramic layer has an outside shape placed, with respect to the center, outside an outside shape of a corner of the ceramic layer disposed under the top ceramic layer.
5 . A package for an optical device, the package comprising a recessed portion formed to mount an optical element at a center,
the package further comprising a package bottom having the recessed portion formed at the center and a package top joined onto the package bottom, wherein at least one of four corners of the package top has an outside shape placed outside an outside shape of a corner of the package bottom with respect to the center.
6 . A package for a solid-state imaging device, the package comprising a recessed portion formed to mount a solid-state imaging element at a center,
the package including a package bottom having the recessed portion formed at the center and a package top joined onto the package bottom, wherein at least one of four corners of the package top has an outside shape placed outside an outside shape of a corner of the package bottom with respect to the center.
7 . The package for a solid-state imaging device according to claim 4 , wherein the top layer is formed of a plurality of ceramic layers.
8 . The package for a solid-state imaging device according to claim 2 , wherein at a point where the corner of the plate-like member of the top layer has an outside shape placed outside the outside shape of the corner of the plate-like member disposed under the plate-like member of the top layer, the corner of the plate-like member disposed under the plate-like member of the top layer is formed into a blur preventing shape including a round, a reversely rounded portion, a chamfer, a notch, and a recessed portion.
9 . The package for a solid-state imaging device according to claim 6 , wherein at a point where the corner of the package top has an outside shape placed outside the outside shape of the corner of the package bottom with respect to the center, a plate-like member disposed under a plate-like member of a top layer has a corner formed into a blur preventing shape including a round, a reversely rounded portion, a chamfer, a notch, and a recessed portion.
10 . The package for a solid-state imaging device according to claim 8 , further comprising one of side plating and underside plating, the side plating being formed on a portion having the blur preventing shape, the underside plating being formed to correspond to the portion having the blur preventing shape on a bottom of the package.
11 . The package for a solid-state imaging device according to claim 9 , further comprising one of side plating and underside plating, the side plating being formed on a portion having the blur preventing shape, the underside plating being formed to correspond to the portion having the blur preventing shape on a bottom of the package.
12 . The package for a solid-state imaging device according to claim 4 , wherein at least one of four corners of a plate-like member of a bottom layer has an outside shape placed, with respect to the center, outside an outside shape of a corner of a plate-like member other than a plate-like member of the top layer, out of plate-like members of the layers disposed on the plate-like member of the bottom layer.
13 . The package for a solid-state imaging device according to claim 12 , wherein the bottom layer is formed of a plurality of ceramic layers.
14 . A method of manufacturing a package for an optical device, when dividing a laminated sheet including stacked ceramic sheets into pieces and forming the package for the optical device, the package including a recessed portion formed to mount a solid-state imaging element at a center,
the method comprising:
forming a first sheet on a ceramic sheet of a base, the first sheet including the stacked ceramic sheets having a first hole formed on a portion corresponding to the recessed portion of each package;
forming a second hole on at least one of corners of portions corresponding to four corners of each package of the first sheet, the second hole acting as a blur preventing shape when the sheet is divided into pieces;
stacking a second sheet on the first sheet, the second sheet having a third hole formed to correspond to the first hole;
forming a cut on a portion corresponding to an outside shape of each package on at least one of a top surface and an underside of a laminated sheet of the first sheet and the second sheet;
baking the laminated sheet including the first sheet and the second sheet with the formed cut; and
dividing the laminated sheet at the cut into packages after the baking.
15 . A method of manufacturing a package for a solid-state imaging device, when dividing a laminated sheet including stacked ceramic sheets into pieces and forming the package for the solid-state imaging device, the package including a recessed portion formed to mount a solid-state imaging element at a center,
the method comprising:
forming a first sheet on a ceramic sheet of a base, the first sheet including the stacked ceramic sheets having a first hole formed on a portion corresponding to the recessed portion of each package;
forming a second hole on at least one of corners of portions corresponding to four corners of each package of the first sheet, the second hole acting as a blur preventing shape when the sheet is divided into pieces;
stacking a second sheet on the first sheet, the second sheet having a third hole formed to correspond to the first hole;
forming a cut on a portion corresponding to an outside shape of each package on at least one of a top surface and an underside of a laminated sheet of the first sheet and the second sheet;
baking the laminated sheet including the first sheet and the second sheet with the formed cut; and
dividing the laminated sheet at the cut into packages after the baking.
16 . A solid-state imaging device comprising a solid-state imaging element on a recessed portion of the package for a solid-state imaging device according to claim 2 .
17 . A solid-state imaging device comprising a solid-state imaging element on a recessed portion of the package for a solid-state imaging device according to claim 4 .
18 . A solid-state imaging device comprising a solid-state imaging element on a recessed portion of the package for a solid-state imaging device according to claim 6 .