IP Library Granted Patent US 7,894,660
Granted Patent B2
US 7,894,660 · App. 11/785,181 · Granted Feb 22, 2011

Image processing alignment method and method of manufacturing semiconductor device

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Quick Facts
Patent No.
US 7,894,660
App. No.
11/785,181
Granted
Feb 22, 2011
Kind
B2
Abstract

An alignment mark is arranged to be within an image screen and the alignment mark is formed with rectangular patterns having varied dimensions from each other. The signal waveforms from each of the rectangular patterns are measured. The number of the rectangular patterns with normal waveforms is compared to the minimum required number of marks prescribed beforehand. The amount of deviation in alignment is calculated by excluding the abnormal measured result.

Claims (38)

1. An image processing alignment method, comprising:

picking up, in a shot, wafer alignment mark comprising a plurality of rectangular patterns having different dimensions from each other;

scanning a plurality of the rectangular patterns in the wafer alignment mark;

measuring signal waveforms from the rectangular patterns through scanning a plurality of the rectangular patterns;

judging normality/abnormality of the rectangular patterns through comparing, with a prescribed standard value, the signal waveforms obtained said measuring; and

calculating amount of positional deviation in alignment by excluding a measured result the rectangular pattern which is judged to be abnormal in said judging.

2. The image processing alignment method according to claim 1 , further comprising:

determining normality/abnormality of measurement of the rectangular patterns through comparing, with a prescribed value, a number of rectangular patterns with normal signal waveforms obtained by scanning the rectangular patterns; and

calculating an amount of positional deviation in alignment by excluding a measured result of the rectangular pattern which is judged to be abnormal in said determining.

3. The image processing alignment method according to claim 1 , further comprising:

processing a mean value of the amount of positional deviation in the alignment as an amount of positional deviation in at least one of the rectangular patterns and the shot.

4. An image processing alignment method comprising:

picking up, in shot, a wafer alignment mark comprising a plurality of rectangular patterns having different dimensions from each other;

scanning a plurality of the rectangular patterns in the wafer alignment mark; and

processing a mean value of the amount of positional deviation in the alignment as an amount of positional deviation in at least one of the rectangular patterns and the shot;

wherein each of said plurality of rectangular patterns comprises four sides, each side having a width, and

wherein the width of each side of each rectangular pattern is different from the width of each side of the other rectangular patterns.

5. The image processing alignment method, comprising:

picking up, in a shot, a wafer alignments mark comprising of a plurality of rectangular patterns having different dimensions from each other;

scanning a plurality of the rectangular patterns in the wafer alignment mark;

determining normality/abnormality of measurement of the rectangular patterns through comparing, with a prescribed value, a number of rectangular patterns with normal signal waveforms obtained by scanning the rectangular patterns; and

calculating an amount of positional deviation in alignment by excluding a measured result of the rectangular pattern which is judged to be abnormal in said determing.

6. The image processing alignment method according to claim 5 , further comprising:

processing a mean value of the amount of positional deviation in the alignment as an amount of positional deviation in at least one of rectangular, patterns or the shot.

7. An image processing alignment method, comprising:

picking up, in a shot, wafer alignment mark comprising a plurality of rectangular patterns having different dimensions from each other;

scanning a plurality of the rectangular patterns in the wafer alignment mark;

measuring signal waveforms from the rectangular patterns through scanning a plurality of the rectangular patterns;

judging normality/abnormality of the rectangular patterns through comparing, with a prescribed standard value, the signal waveforms obtained said measuring; and

calculating an amount of positional deviation in alignment by excluding a measured result the rectangular pattern which is judged to be abnormal in said judging,

wherein by calculating an amount of positional deviation, deterioration of accuracy is suppressed.

8. The image processing alignment method according to claim 1 , further comprising:

determining normality/abnormality of measurement of the rectangular patterns through comparing, with a prescribed value, a number of rectangular patterns with normal signal waveforms obtained by scanning the rectangular patterns; and

calculating an amount of positional deviation in alignment by excluding a measured result of the rectangular pattern which is judged to be abnormal in said determining,

wherein by calculating an amount of positional deviation, deterioration of accuracy is suppressed.

9. The image processing alignment method according to claim 6 , further comprising:

processing a mean value of the amount of positional deviation in the alignment as an amount of positional deviation in at least one of the rectangular patterns and the shot,

wherein by processing the mean value deterioration in alignment accuracy is suppressed.

Assignments (1)
CHANGE OF NAME Recorded Nov 4, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025311/0869 →