Piezoelectric device
View Patent ↗A piezoelectric device includes a piezoelectric element package having a piezoelectric element accommodated therein and a connection terminal formed on a side surface and a bottom surface thereof, a circuit element coupled to the connection terminal on the bottom surface of the piezoelectric element package, an insulating resin portion being in an essentially rectangular parallelepiped shape and covering the circuit element, an external electrode formed on a bottom surface of the resin portion, and a connection electrode formed on the side surface of the piezoelectric element package and a side surface of the resin portion and coupling the connection terminal formed on the side surface of the piezoelectric element package and the external electrode on the resin portion.
1. A piezoelectric device, comprising:
a piezoelectric element package having a piezoelectric element accommodated therein and a connection terminal formed on a side surface and a bottom surface thereof;
a circuit element coupled to the connection terminal on the bottom surface of the piezoelectric element package;
an insulating resin portion being in an essentially rectangular parallelepiped shape and covering the circuit element;
an external electrode formed on a bottom surface of the resin portion; and
a connection electrode formed on the side surface of the piezoelectric element package and a side surface of the resin portion and coupling the connection terminal formed on the side surface of the piezoelectric element package and the external electrode on the resin portion.
2. The piezoelectric device according to claim 1 , wherein the connection electrode and the external electrode are formed with an electrode made of conductive ink deposited on from the side surface of the piezoelectric element package to the bottom surface of the resin portion.
3. The piezoelectric device according to claim 1 , wherein the connection electrode and the external electrode are formed with an electrode made of a conductive paste settled on from the side surface of the piezoelectric element package to the bottom surface of the resin portion.