Semiconductor acceleration sensor
A semiconductor acceleration sensor of the invention comprises: a sensor chip having a pad formation surface around whose edge are formed a plurality of pads, and in which a rectangular frame shaped protrusion is formed on an area of the pad formation surface on a center side of the pads; and a control chip which has a terminal formation surface on which connection terminals are formed, and has a planar shape such that the pad of the sensor chip is visible from the terminal formation surface side. Moreover, the opposite surface of the control chip to the terminal formation surface is bonded to the frame shaped protrusion of the sensor chip.
1 . A semiconductor acceleration sensor comprising:
a sensor chip having a pad formation surface around whose edge are formed a plurality of pads, and in which a rectangular frame shaped protrusion is formed on an area of said pad formation surface on a center side of said pads; and
a control chip which has a terminal formation surface on which connection terminals are formed, and has a planar shape such that the pad of said sensor chip is visible from said terminal formation surface side,
wherein an opposite surface of said control chip to the terminal formation surface is bonded to the frame shaped protrusion of said sensor chip.
2 . A semiconductor acceleration sensor according to claim 1 , wherein connection terminals of said control chip are formed on said frame shape protrusion.
3 . A semiconductor acceleration sensor according to claim 1 , wherein said control chip has a planar shape that is smaller than a rectangular shape inscribed in the pads of said sensor chip.
4 . A semiconductor acceleration sensor according to claim 1 , wherein said control chip has a through hole through which the pads of said sensor chip are visible.
5 . A semiconductor acceleration sensor according to claim 1 , wherein said control chip has a notch through which the pads of said sensor chip are visible.
6 . A semiconductor acceleration sensor according to claim 1 , wherein a rear plate is bonded to an opposite surface of said the sensor chip to the pad formation surface.
7 . A semiconductor acceleration sensor comprising:
a sensor chip having a pad formation surface around whose edge are formed a plurality of pads; and
a control chip which has a terminal formation surface on which connection terminals are formed, and has a planar shape such that the pad of said sensor chip is visible from said terminal formation surface side,
wherein an opposite surface of said control chip to the terminal formation surface is bonded by an adhesive to the pad formation surface of said sensor chip.
8 . A semiconductor acceleration sensor according to claim 7 , wherein said control chip has a planar shape that is smaller than a rectangular shape inscribed in the pads of said sensor chip.
9 . A semiconductor acceleration sensor according to claim 7 , wherein said control chip has a through hole through which the pads of said sensor chip are visible.
10 . A semiconductor acceleration sensor according to claim 7 , wherein said control chip has a notch through which the pads of said sensor chip are visible.
11 . A semiconductor acceleration sensor according to claim 7 , wherein a rear plate is bonded to an opposite surface of said the sensor chip to the pad formation surface.