Semiconductor strain sensor
View Patent ↗An SOI substrate includes a thin diaphragm portion that is formed by removing a portion of the substrate from a rear surface side, and a thick outer frame portion that surrounds the diaphragm portion. A piezoresistive element that outputs an electrical signal in response to pressure is formed on the diaphragm portion, and an electrode that extracts the electrical signal from the piezoresistive element is formed on the outer frame portion. The electrode is disposed at a position on the outer frame portion that is separated by greater than or equal to 100 μm from a boundary line between the diaphragm portion and the outer frame portion.
1. A semiconductor strain sensor comprising:
a silicon-on-insulator (SOI) substrate comprising:
a thin diaphragm portion that is formed by removing a portion of said substrate from a rear surface side; and
a thick outer frame portion that surrounds said diaphragm portion;
a piezoresistive element that is formed on said diaphragm portion, and that outputs an electrical signal in response to pressure; and
an electrode that is formed on said outer frame portion, and that extracts said electrical signal from said piezoresistive element,
wherein said electrode is disposed at a position that is separated by greater than or equal to 100 μm from a boundary between said diaphragm portion and said outer frame portion.
2. A semiconductor strain sensor according to claim 1 , wherein said electrode is disposed at a position that is separated by greater than or equal to 120 μm from said boundary between said diaphragm portion and said outer frame portion.
3. A semiconductor strain sensor according to claim 1 , wherein a thickness of said diaphragm portion is less than or equal to 30 μm.