IP Library Granted Patent US 7,859,528
Granted Patent B2
US 7,859,528 · App. 11/787,276 · Granted Dec 28, 2010

Power module for energy recovery and discharge sustain of plasma display panel

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Quick Facts
Patent No.
US 7,859,528
App. No.
11/787,276
Granted
Dec 28, 2010
Kind
B2
Abstract

A power module for energy recovery and sustain of a plasma display panel is disclosed. The power module includes a first high-voltage integrated circuit which is of a single type, a first switching element for receiving an output from the first high-voltage integrated circuit, and performing a switching operation in response to the output received from the first high-voltage integrated circuit, a first diode connected to one terminal of the first switching element, a second high-voltage integrated circuit which is of a single type, and is arranged symmetrically with the first high-voltage integrated circuit, a second switching element for receiving an output from the second high-voltage integrated circuit, and performing a switching operation in response to the output received from the second high-voltage integrated circuit, and a second diode connected to one terminal of the second switching element.

Claims (19)

1. A power module for energy recovery and sustain of a plasma display panel comprising:

a first high-voltage integrated circuit which is of a single type;

a first switching element configured to receive an output from the first high-voltage integrated circuit, and to perform a switching operation in response to the output received from the first high-voltage integrated circuit;

a first diode connected to a terminal of the first switching element;

a second high-voltage integrated circuit which is of a single type, and is arranged symmetrically with the first high-voltage integrated circuit;

a second switching element configured to receive an output from the second high-voltage integrated circuit, and to perform a switching operation in response to the output received from the second high-voltage integrated circuit; and

a second diode connected to a terminal of the second switching element.

2. The power module according to claim 1 , wherein each of the first and second switching elements is an active switching element.

3. The power module according to claim 1 , wherein the first diode includes an anode connected to an emitter of the first switching element, and the second diode includes a cathode connected to a collector of the second switching element.

4. The power module according to claim 1 , wherein:

the first switching element includes a collector, and the first diode includes a cathode, the collector and the cathode constituting a sustain voltage input terminal;

the second diode includes an anode, and the second switching element includes an emitter, the anode and the emitter constituting a ground; and

the first switching element includes an emitter, and the second switching element includes a collector, the emitter and the collector constituting an output terminal.

5. The power module according to claim 1 , wherein:

the first switching element includes a collector, and the second switching element includes an emitter, the collector and the emitter being connected to an external energy recovery capacitor; and

the first diode includes a cathode, and the second diode includes an anode, the cathode and the anode constituting an input/output line.

6. The power module according to claim 1 , further comprising:

a first buffer arranged between the first high-voltage integrated circuit and the first switching element, and adapted to increase a current output from the first high-voltage integrated circuit; and

a second buffer arranged between the second high-voltage integrated circuit and the second switching element, and adapted to increase a current output from the second high-voltage integrated circuit.

Assignments (4)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 04481, FRAME 0541 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064072/0459 →
PATENT SECURITY AGREEMENT Recorded Nov 17, 2017
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 044481/0541 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 2, 2017
From: FAIRCHILD KOREA SEMICONDUCTOR, LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044361/0205 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2009
From: CHO, BYOUNG-CHUL; LEE, JUN-BAE; CHUNG, DAE-WOONG; SUH, BUM-SEOK
To: FAIRCHILD KOREA SEMICONDUCTOR, LTD.
Reel/Frame 022245/0313 →