IP Library Granted Patent US 8,259,982
Granted Patent B2
US 8,259,982 · App. 11/787,657 · Granted Sep 4, 2012

Reducing acoustic coupling to microphone on printed circuit board

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Quick Facts
Patent No.
US 8,259,982
App. No.
11/787,657
Granted
Sep 4, 2012
Kind
B2
Abstract

A mobile computing device comprises a printed circuit board, a processing circuit, a surface mount microphone, and a vibration attenuation portion. The processing circuit is disposed on a first portion of the printed circuit board. The surface mount microphone is disposed on a second portion of the printed circuit board. The vibration attenuation portion of the board is configured to attenuate vibrations from the first to the second portion of the printed circuit board.

Claims (23)

1. An electronic device, comprising:

a printed circuit board defining at least one elongated aperture between a first portion and a second portion of the printed circuit board; and

a microphone coupled to the first portion of the printed circuit board and at least one other electronic component coupled to the second portion of the printed circuit board,

the at least one elongated aperture substantially surrounding the microphone to attenuate vibrations traveling along the second portion of the printed circuit board.

2. The electronic device of claim 1 , further comprising a mobile telephony circuit coupled to the microphone.

3. The electronic device of claim 2 , further comprising a processing circuit configured to operate a plurality of personal information management applications and to wireles sly synchronize personal data with a remote computer.

4. The electronic device of claim 1 , wherein the second portion is disposed in a corner of the printed circuit board.

5. The electronic device of claim 1 , wherein the printed circuit board defines at least one bridge adjacent to the at least one elongated aperture, further comprising a conductor extending from the microphone to the at least one other electronic component along the at least one bridge.

6. The electronic device of claim 1 , wherein the printed circuit board comprises a plurality of layers, wherein the aperture extends through all of the plurality of layers.

7. The electronic device of claim 1 , further comprising at least one additional electronic component coupled to the second portion of the printed circuit board.

8. The electronic device of claim 1 , wherein the printed circuit board defines a plurality of elongated apertures substantially isolating the first portion of the printed circuit board from the second portion of the printed circuit board.

9. The electronic device of claim 1 , further comprising a shock absorbing substrate disposed over the microphone and defining an aperture extending from an audio input on the microphone through the substrate to a housing of the electronic device.

10. The electronic device of claim 1 , wherein the microphone is a surface mount microphone.

11. The electronic device of claim 10 , further comprising a shock absorbing substrate encapsulating the surface mount microphone on both sides of the printed circuit board.

12. A mobile computing device, comprising:

a printed circuit board;

a processing circuit disposed on a first portion of the printed circuit board;

a surface mount microphone disposed on a second portion of the printed circuit board; and

a vibration attenuation portion of the printed circuit board to attenuate vibrations from the first to the second portion of the printed circuit board, the vibration attenuation portion comprising perforations in the printed circuit board.

13. The mobile computing device of claim 12 , wherein the vibration attenuation portion of the board comprises bridges between the perforations, at least one of the bridges carrying a conductor extending between the surface mount microphone and an electronic component on the first portion of the printed circuit board.

14. The mobile computing device of claim 12 , wherein the second portion of the printed circuit board extends to at least one edge of the printed circuit board and the vibration attenuation portion substantially surrounds the surface mount microphone along with the at least one edge.

15. The mobile computing device of claim 12 , further comprising a housing coupled with the printed circuit board, the housing configured to be carried in the hand of a user.

16. The mobile computing device of claim 12 , further comprising a mobile telephony circuit coupled to the microphone.

Assignments (9)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 28, 2014
From: HEWLETT-PACKARD COMPANY; HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.; PALM, INC.
To: QUALCOMM INCORPORATED
Reel/Frame 032132/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2013
From: PALM, INC.
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 031837/0239 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2013
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: PALM, INC.
Reel/Frame 031837/0544 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2013
From: PALM, INC.
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 031837/0659 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 3, 2013
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: PALM, INC.
Reel/Frame 030341/0459 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 3, 2011
From: BOWEN, JAMES SAMUEL
To: PALM, INC.
Reel/Frame 026219/0344 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 28, 2010
From: PALM, INC.
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 025204/0809 →
RELEASE OF SECURITY INTEREST Recorded Jul 6, 2010
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: PALM, INC.
Reel/Frame 024630/0474 →
SECURITY AGREEMENT Recorded Jan 9, 2008
From: PALM, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 020341/0285 →