High reliability power module
View Patent ↗A high reliability power module which includes a plurality of hermetically sealed packages each having electrical terminals formed from an alloy of tungsten copper and brazed onto a surface of a ceramic substrate.
1. A power semiconductor module comprising:
a base plate;
a plurality of individually hermetically sealed power semiconductor packages arranged on said base plate;
a plurality of stress relieved buses interconnecting said packages electrically to form a power stage of a power circuit;
a cover; and
a plurality of stress relieved leads connected to said power stage and extending through said cover.
2. The power semiconductor module of claim 1 , wherein said power stage is a half-bridge.
3. The power semiconductor module of claim 1 , wherein each power semiconductor package includes an IGBT.
4. The power semiconductor module of claim 1 , wherein each power semiconductor package includes a substrate, said substrate including a first major surface, and a second major surface opposite said first major surface; a first electrical terminal on said first major surface of said substrate; a second electrical terminal on said second major surface of said substrate; and a semiconductor device having a first electrode electrically connected to said first electrical terminal and a second electrode electrically connected to said second electrical terminal; wherein each power semiconductor package is hermetically sealed by said second electrical terminal and a package cover disposed around said semiconductor device.
5. The power semiconductor module of claim 4 , wherein said substrate is comprised of a ceramic material.
6. The power semiconductor module of claim 5 , wherein said substrate is comprised of alumina.
7. The power semiconductor module of claim 4 , wherein said terminals are comprised of a copper tungsten alloy.
8. The power semiconductor module of claim 4 , wherein said alloy substantially consists of 80% tungsten and 20% copper by weight.
9. The power semiconductor module of claim 4 , wherein said alloy substantially consists of 85% tungsten by weight and 15% copper by weight.
10. The power semiconductor module of claim 4 , wherein said hermetically sealed package cover includes a ceramic enclosure disposed around said semiconductor device and hermetically attached to said substrate, and a lid hermetically attached to said ceramic enclosure.
11. The power semiconductor module of claim 10 , further comprising a hermetic seal disposed between said lid and said ceramic enclosure.
12. The power semiconductor module of claim 11 , wherein said hermetic seal is comprised of 80% gold and 20% tin by weight.
13. The power semiconductor module of claim 12 , wherein said lid is comprised of either Kovar or Alloy 42.
14. The power semiconductor module of claim 4 , wherein said first terminal of each package is electrically and mechanically coupled to a conductive pad on said base plate by a conductive adhesive.