Resist for printing and patterning method using the same

1. A resist for printing that is coated on a printing roll and is then sequentially transcribed on a printing plate and a substrate comprising:

a material wherein a cohesive energy between the resist and the printing plate is larger than a cohesive energy between the resist and a blanket formed on the surface of printing roll, and

wherein a cohesive energy between the resist and the substrate is larger than the cohesive energy between the resist and the blanket formed on the surface of printing roll,

wherein the resist for printing is mixed with a solvent including any one among perfluorotributylamine, nitromethane, dimethysulfoxide, ethylene glycol, glycerol, and water when coating the printing roll with the resist, and

wherein the solvent vaporizes as soon as the resist for printing mixed with the solvent is coated on the blanket and a surface energy of mixture of the resist and the solvent is similar to or slightly smaller than a surface energy of the blanket;

wherein a total cohesive energy of the resist with the printing plate and blanket is greater than a total fracture energy required for fracturing the resist coated on the blanket; and

wherein a first value obtained by subtracting the cohesive energy between the resist and the blanket from the cohesive energy between the resist and the printing plate and multiplying the subtraction result and a distance of a protrusion formed on the printing plate together is greater than a second value obtained by multiplying a fracture energy of the resist and a thickness of the resist coated on the blanket together.

2. The resist of claim 1 , wherein the fracture energy is less than 1000 mJ/m 2 .

3. The resist of claim 1 , wherein a molecular weight of resist is less than 33,000.

4. The resist of claim 1 , wherein a surface energy of the resist for printing is greater than a surface energy of the blanket and is also less than a surface energy of the printing plate and substrate.

5. The resist of claim 4 , wherein the surface energy of the resist for printing is greater than 25 mJ/m 2 and is smaller than 40 mJ/m 2 .

6. The resist of claim 1 , wherein a solubility parameter of the solvent is different from that of the resist for printing when coating the printing roll with the resist.

7. The resist of claim 6 , wherein the solubility parameter of solvent is less than 6 cal 1/2 cm −3/2 or is greater than 11 cal 1/2 cm 3/2 .

8. The resist of claim 6 , wherein the dipole moment value of the solvent is different from the dipole moment value of the blanket.

9. The resist of claim 8 , wherein the dipole moment value of the solvent is larger than 2D.

10. A patterning method comprising:

forming a pattern material layer on a substrate;

coating a printing roll having a blanket adhered thereto with a resist for printing mixed with a solvent, wherein the solvent vaporizes as soon as the resist for printing mixed with the solvent is coated on the blanket and a surface energy of mixture of the resist and the solvent is similar to or slightly smaller than a surface energy of the blanket;

transcribing some of the resist on a printing plate by rolling the printing roll on the printing plate;

transcribing the remaining resist of printing roll on a substrate by rolling the printing roll on the substrate including the pattern material layer;

etching the pattern material layer; and

removing the resist for printing from the substrate,

wherein the resist for printing includes a material wherein a cohesive energy between the resist and the printing plate is larger than a cohesive energy between the resist and a blanket formed on the surface of printing roll and wherein a cohesive energy between the resist and the substrate is larger than the cohesive energy between the resist and the blanket formed on the surface of printing roll, and

wherein the solvent including any one among perfluorotributylamine, nitromethane, dimethysulfoxide, ethylene glycol, glycerol, and water when coating the printing roll with the resist;

wherein a total cohesive energy of the resist with the printing plate and blanket is greater than a total fracture energy required for fracturing the resist coated on the blanket; and

wherein a first value obtained by subtracting the cohesive energy between the resist and the blanket from the cohesive energy between the resist and the printing plate and multiplying the subtraction result and a distance of a protrusion formed on the printing plate together is greater than a second value obtained by multiplying a fracture energy of the resist and a thickness of the resist coated on the blanket together.

11. The patterning method of claim 10 , wherein the blanket provided on the surface of printing roll is formed of PDMS (polydimethyl siloxane).

12. The resist of claim 10 , wherein the fracture energy is less than 1000 mJ/m 2 .

13. The resist of claim 10 , wherein a molecular weight of resist is less than 33,000.

14. The resist of claim 10 , wherein a surface energy of the resist for printing is greater than a surface energy of the blanket and is also less than a surface energy of the printing plate and substrate.

15. The resist of claim 14 , wherein the surface energy of the resist for printing is greater than 25 mJ/m 2 and is smaller than 40 mJ/m 2 .

16. The resist of claim 10 , wherein a solubility parameter of the solvent is different from that of the resist for printing when coating the printing roll with the resist.

17. The resist of claim 16 , wherein the solubility parameter of solvent is less than 6 cal 1/2 cm −3/2 or is greater than 11 cal 1/2 cm −3/2 .

18. The resist of claim 16 , wherein the dipole moment value of the solvent is different from the dipole moment value of the blanket.

19. The resist of claim 10 , wherein the dipole moment value of the solvent is larger than 2 D.