Methods for manufacturing a sensor assembly

1. A method for connecting substrates having electrical conductive elements thereon, comprising:

providing at least one spacer between said substrates, wherein said at least one spacer is spaced away from the conductive elements,

applying a conductive material to at least one of said electrical conductive elements;

aligning said electrical conductive elements;

connecting said substrates by urging them together, wherein said at least one spacer prevents lateral spreading of said conductive material on said substrates from bridging a distance between adjacent conductive elements during said connecting by providing a counter acting force to the urging and wherein said at least one spacer determines a distance between said substrates; and

filling in gaps between said substrates.

2. A method according to claim 1 , wherein said gaps are filled in with a non-conductive adhesive.

3. A method according to claim 1 , wherein at least one said substrates is a PCB.

4. A method according to claim 1 , wherein at least one said substrates is a sensor array.

5. A method according to claim 1 , wherein said at least one spacer is non-conductive.

6. A method according to claim 5 , wherein said at least one non-conductive spacer is planar.

7. A method according to claim 5 , wherein said at least one non-conductive spacer is elongate.

8. A method according to claim 6 wherein the planar spacer prevents lateral spread by blocking said spread.

9. A method according to claim 1 , wherein said electrical conductive elements are pads.

10. A method according to claim 1 , wherein said urging is performed by a weight.

11. A method according to claim 1 , wherein said urging planarizes at least one of said substrates by conforming said electrical component to the at least one spacer.

12. A method according to claim 1 , wherein said conductive material is at least one of a conductive adhesive and a conductive epoxy.