IP Library Granted Patent US 7,498,896
Granted Patent B2
US 7,498,896 · App. 11/796,518 · Granted Mar 3, 2009

Waveguide to microstrip line coupling apparatus

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Quick Facts
Patent No.
US 7,498,896
App. No.
11/796,518
Granted
Mar 3, 2009
Kind
B2
Abstract

Electrical coupling apparatus providing transition between a high radio frequency waveguide and a perpendicularly oriented microstrip line without use of a shorting cap fixes an open end of the waveguide perpendicularly to a dielectric substrate. The microstrip line is carried on the substrate and couples through a hole in the waveguide wall to a microstrip patch on the substrate within the waveguide having a resonance with the waveguide encompassing a predetermined high radio frequency bandwidth of signals to be conducted by the apparatus. A plurality of parallel conducting members form a via fence aligned with the waveguide wall and extending through the substrate to electrically connect the waveguide to a planar ground conductor that covers the opposite side of the substrate, including the area under the open end of the waveguide.

Claims (17)

1. High frequency electrical waveguide to microstrip line coupling apparatus comprising:

a waveguide comprising a generally cylindrical wall;

a substrate having a ground plane conductor one side and a microstrip line coupled to a microstrip patch on an opposite side, the microstrip patch having a resonance with the waveguide encompassing a predetermined high radio frequency bandwidth of signals to be conducted by the apparatus, the waveguide having an end perpendicularly attached to the substrate surrounding and substantially centered on the microstrip patch and further having a wall opening adjacent the substrate through which the microstrip extends; and

a via fence comprising a plurality of parallel conductors aligned with the waveguide wall and extending through the substrate to electrically couple the waveguide to the ground plane conductor, the ground plane conductor extending substantially across the entire area of the substrate bounded by the via fence.

2. The high frequency waveguide to microstrip line coupling apparatus of claim 1 wherein the microstrip line is coupled to the microstrip patch through a quarter wavelength impedance transformer.

3. The high frequency electrical waveguide to microstrip line coupling apparatus of claim 2 wherein the microstrip line, quarter wavelength impedance transformer and microstrip patch comprise a single, continuous electrical conductor.

4. The high frequency waveguide to microstrip line coupling apparatus of claim 1 wherein the patch has a pair of opposite sides generally aligned with the microstrip line having edge lengths tuned to help determine the predetermined high radio frequency bandwidth.

5. The high frequency electrical waveguide to microstrip line coupling apparatus of claim 4 wherein the microstrip patch is substantially rectangular.

6. The high frequency electrical waveguide to microstrip line coupling apparatus of claim 4 wherein at least one of the opposite sides is bent toward the other to provide a longer current path than that of a straight side having the same end points, whereby the tuned wavelength of the microstrip patch is longer than that produced by straight sides having the same ends.

7. The high frequency electrical waveguide to microstrip line coupling apparatus of claim 6 wherein the at least one of the opposite sides is at least partially arcuate.

8. The high frequency electrical waveguide to microstrip line coupling apparatus of claim 7 wherein the at least one of the opposite sides comprises one of a circular arc and an elliptical arc.

9. The high frequency electrical waveguide to microstrip line coupling apparatus of claim 6 wherein the opposite sides are both arcuate.

10. The high frequency electrical waveguide to microstrip line coupling apparatus of claim 6 wherein at least one of the opposite sides comprises at least two non-parallel lines, at least one of which is a straight line segment.

11. The high frequency electrical waveguide to microstrip line coupling apparatus of claim 10 wherein the at least one of the opposite sides comprises a plurality of straight line segments.

12. The high frequency electrical waveguide to microstrip line coupling apparatus of claim 11 wherein each of the opposite sides comprises a plurality of straight line segments.

13. The high frequency electrical waveguide to microstrip line coupling apparatus of claim 4 wherein at least one of the opposite sides comprises a convex portion between a pair of concave portions.

14. The high frequency electrical waveguide to microstrip line coupling apparatus of claim 1 wherein the microstrip line and microstrip patch comprise a single, continuous electrical conductor.

Assignments (9)
ENTITY CONVERSION Recorded Feb 11, 2024
From: APTIV TECHNOLOGIES LIMITED
To: APTIV TECHNOLOGIES (2) S.À R.L.
Reel/Frame 066746/0001 →
MERGER Recorded Feb 11, 2024
From: APTIV TECHNOLOGIES (2) S.À R.L.
To: APTIV MANUFACTURING MANAGEMENT SERVICES S.À R.L.
Reel/Frame 066566/0173 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2024
From: APTIV MANUFACTURING MANAGEMENT SERVICES S.À R.L.
To: APTIV TECHNOLOGIES AG
Reel/Frame 066551/0219 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2018
From: DELPHI TECHNOLOGIES INC.
To: APTIV TECHNOLOGIES LIMITED
Reel/Frame 047143/0874 →
RELEASE OF SECURITY INTEREST Recorded Jan 14, 2015
From: JPMORGAN CHASE BANK, N.A.
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 034762/0540 →
SECURITY AGREEMENT Recorded Apr 18, 2011
From: DELPHI TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 026146/0173 →
RELEASE OF SECURITY INTEREST Recorded Apr 15, 2011
From: THE BANK OF NEW YORK MELLON
To: DELPHI CONNECTION SYSTEMS HOLDINGS LLC; DELPHI PROPERTIES MANAGEMENT LLC; DELPHI TECHNOLOGIES, INC.; DELPHI AUTOMOTIVE SYSTEMS LLC; DELPHI CONNECTION SYSTEMS LLC; DELPHI CORPORATION; DELPHI HOLDINGS LLC; DELPHI INTERNATIONAL SERVICES COMPANY LLC; DELPHI MEDICAL SYSTEMS LLC; DELPHI TRADE MANAGEMENT LLC
Reel/Frame 026138/0574 →
SECURITY AGREEMENT Recorded Nov 13, 2009
From: DELPHI TECHNOLOGIES, INC.
To: BANK OF NEW YORK MELLON, AS ADMINISTRATIVE AGENT, THE
Reel/Frame 023510/0562 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 27, 2007
From: SHI, SHAWN
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 019312/0792 →