Solid-state image sensing device

1. A solid-state image sensing device, comprising:

an interconnect substrate having an entirety of an upper surface that is continuous and substantially flat;

a solid-state image sensing chip having an entire back surface that is substantially flat and a front surface that is on the side opposite to said back surface, said solid-state image sensing chip being flip-chip mounted on said upper surface of said interconnect substrate and operable to take a picture of an object to be imaged by photoelectrically converting light incident on the back surface of said solid-state image sensing chip with the back surface directly contacting the object;

a gap defining a volume provided uniformly between i) said front surface of said solid-state image sensing chip and ii) a whole region of said interconnect substrate facing and located beneath said front surface of said solid-state image sensing chip;

a light-blocking, under-filling resin filling an entirety of said gap and volume provided between said front surface of the solid-state image sensing chip and said interconnect substrate facing and located beneath said front surface of said solid-state image sensing chip, said under-filling resin filling said volume blocking light from entering said gap and said front face of the solid-state image sensing chip; and

a light-blocking, side-filling resin covering side surfaces of said solid-state image sensing chip and side surfaces of said under-filling resin and blocking said light from entering the side surfaces of said solid-state image sensing chip, and

wherein said side-filling resin is formed so as not to overlap with said solid-state image sensing chip in plan-view.

2. The solid-state image sensing device as set forth in claim 1 , wherein said side-filling resin extends from an upper edge of the side surfaces of solid-state image sensing chip to the upper surface of said interconnect substrate, contacts and completely surrounds said under-filling resin.

3. A solid-state image sensing device, comprising:

an interconnect substrate having a first surface;

a solid-state image sensing chip having a second surface, a third surface that is on the side opposite to the second surface, and a fourth surface located between the second surface and the third surface, the solid-state image sensing chip being mounted on the interconnect substrate so that the second surface faces the first surface and is operable to photoelectrically convert a light incidents on the third surface;

a plurality of bumps formed between the first surface and the second surface;

a first resin filling in between the first surface and the second surface and blocking a first light from a front surface of the chip; and

a second resin being in contact with the fourth surface and blocking a second light from a side surface of the chip,

wherein the first resin has an extended portion extended to outside of the second surface and the second resin is in contact with the extended portion.

4. The solid-state image sensing device as set forth in claim 3 , wherein the second resin is in contact with the interconnect substrate.

5. The solid-state image sensing device as set forth in claim 3 , wherein the second resin does not overlap with the second surface in plan-view.

6. The solid-state image sensing device as set forth in claim 3 , wherein the first resin is located on the first surface and not located on the second surface.

7. The solid-state image sensing device as set forth in claim 3 , wherein the third surface directly contacts an object to be imaged.

8. The solid-state image sensing device as set forth in claim 3 , wherein an entirety of the third surface is flat.

9. The solid-state Image sensing device as set forth in claim 3 , wherein an entirety of the first surface is flat.

10. The solid-state image sensing device as set forth in claim 3 , wherein the first resin is in contact with a part of the fourth surface.

11. The solid-state image sensing device as set forth in claim 3 , wherein an object to be imaged is a finger, and the solid-state image sensing chip is used to take an image of the fingerprint of the finger.

12. The solid-state image sensing device as set forth in claim 3 , wherein the first resin is surrounded by the second resin.

13. The solid-state image sensing device as set forth in claim 3 , wherein the solid-state image sensing chip includes a charge coupled device.

14. The solid-state image sensing device as set forth in claim 3 , wherein the interconnect substrate includes a printed circuit board.

15. The solid-state image sensing device as set forth in claim 3 , wherein the first resin includes opaque particles.

16. The solid-state image sensing device as set forth in claim 3 , wherein the first resin includes one of an epoxy resin, a silicon resin, and acrylate resin.

17. The solid-state image sensing device as set forth in claim 3 , wherein light that incidents on the third surface is provided by one of an LED and a fluorescent bulb.

18. The solid-state image sensing device as set forth in claim 3 , wherein the solid-state image sensing chip is of a back-illuminating type.

19. The solid-state image sensing device as set forth in claim 3 , wherein the third surface opposingly faces a corresponding portion of the first surface.