Liquid cooled power electronic circuit comprising stacked direct die cooled packages
View Patent ↗A plurality of direct die cooled semiconductor power device packages are vertically stacked with both coolant and electrical interfacing to form a liquid cooled power electronic circuit. The packages are individually identical, and selectively oriented prior to stacking in order to form the desired circuit connections and laterally stagger the package leads.
1. A liquid cooled power electronic circuit, comprising:
a vertically stacked assembly of liquid cooled semiconductor packages configured for inter-package flow of liquid coolant through the semiconductor packages of said assembly, where each semiconductor package includes a semiconductor chip and a pair of conductive plates that cooperate to enclose the semiconductor chip and that contact terminals of said semiconductor chip, and where juxtaposed plates of said vertically stacked semiconductor packages are electrically joined to provide electrical interconnects between the semiconductor chips enclosed in adjacent packages of said vertically stacked assembly and thereby define one or more power electronic circuits.
2. The liquid cooled power electronic circuit of claim 1 , where:
said packages include a fluid chamber vertically bounded by a first plate and a second plate, with the semiconductor chip mounted in the fluid chamber, a first set of vertically oriented fluid passages formed in said first plate for receiving and exhausting liquid coolant, and a second set of vertically oriented fluid passages formed in said second plate that are vertically aligned with the first set of fluid passages for allowing the inter-package flow of liquid coolant when the packages are vertically stacked.
3. The liquid cooled power electronic circuit of claim 1 , where:
the fluid passages of a given package are symmetrically disposed about a horizontal axis, and selected packages of said assembly are flipped about said horizontal axis prior to assembly to thereby change the electrical interconnects between the selected packages and any adjacent packages of said vertically stacked assembly while preserving the inter-package flow of liquid coolant through said assembly.
4. The liquid cooled power electronic circuit of claim 3 , where:
said semiconductor packages each include laterally extending electrical leads that are asymmetrically disposed about said horizontal axis such that the leads of the selected packages are vertically misaligned with the leads of the other packages of the assembly.
5. The liquid cooled power electronic circuit of claim 1 , where:
said semiconductor packages each include laterally extending electrical leads;
the fluid passages of a given package are symmetrically disposed about a vertical axis; and
selected packages of said assembly are rotated about said vertical axis prior to assembly to thereby change a location of the electrical leads for such packages while preserving the inter-package flow of liquid coolant through said assembly.
6. The liquid cooled power electronic circuit of claim 1 , where said liquid cooled semiconductor packages each comprise:
an insulative frame vertically bounded by a first plate and a second plate to define a fluid chamber where said semiconductor chip is disposed in the fluid chamber; and
the terminals of said semiconductor chip are coupled to said first and second plates by solder or conductive adhesive to electrically and mechanically tie said semiconductor chip to said semiconductor package.
7. The liquid cooled power electronic circuit of claim 6 , where:
lateral extensions of said first and second plates form electrical leads of said package.
8. The liquid cooled power electronic circuit of claim 6 , where:
said insulative frame is molded onto said first plate.
9. The liquid cooled power electronic circuit of claim 6 , where:
said insulative frame is formed of ceramic with metalized surfaces for attachment to said first and second plates by solder or conductive adhesive.
10. The liquid cooled power electronic circuit of claim 1 , where:
said semiconductor chip is a transistor, and the power electronic circuit is an H-Bridge or a 1/2 -H-Bridge.
11. The liquid cooled power electronic circuit of claim 6 , further comprising:
fluid inlet and outlet passages formed in opposite ends of said first plate within said insulative frame for admitting and exhausting liquid coolant, said semiconductor chip having a major face that is mounted on said first plate and undercut to form fluid conducting channels that conduct the liquid coolant from said inlet passage to said outlet passage.
12. The liquid cooled power electronic circuit of claim 1 , where:
said juxtaposed plates are mechanically and electrically joined by solder or conductive adhesive.