Actuation of parallel microfluidic arrays
View Patent ↗An improved actuator for use in a microfluidic particle sorting system utilizes a staggered packing scheme for a plurality of actuators used to selectively deflect a particle in an associated sorting channel from a stream of channels. An actuator block may be provided for housing a two-dimensional array of actuators, each configured to align with an actuation port in an associated sorting chip containing a plurality of sorting channels. The actuator block may include a built-in stressing means to pre-stress each actuator housed by the block. An actuator comprising a piezo-electric stack may employ contact-based electrical connection rather than soldered wires to improve packing density. The actuator may be an external actuator. That is, the external actuator is external to the substrate in which the sorting channels are formed.
1. A system for sorting particles, comprising:
a microfluidic chip containing a plurality of microsorters, each microsorter having an actuation port for interfacing with a displacement actuator for selectively actuating the microsorter to deflect a particle having a predetermined characteristic from a stream of particles, wherein at least one of the actuation ports of a first microsorter is located in a different coordinate along the chip from an actuation port of a second microsorter;
an external actuator packing block holding a plurality of displacement actuators and a plurality of actuation devices such that the location of each actuation device in the block corresponds to the location of an associated actuator port in the microsorter chip when the block and chip are brought together, wherein each of the plurality of displacement actuators is formed by a plurality of piezo-electric elements in a stacked relationship and each of the plurality of displacement actuators is coupled to a respective one of the plurality of actuation devices; and
an electric connector mounted to each stack of piezo-electric elements.
2. The system of claim 1 , wherein the block provides pre-compression of each displacement actuator in an unexcited state.
3. The system of claim 1 , wherein the displacement actuators each include an electroconstrictive displacement actuator.
4. The system of claim 1 , wherein the actuation ports and displacement actuators are formed in an array having at least two rows.
5. The system of claim 1 , wherein the actuation ports and displacement actuators are formed in an array having three rows.
6. The system of claim 1 , wherein each microsorter comprises a branching switching region including a main sorting channel and two outlet channels, and an actuator port arm extending from the main sorting channel and terminating in the actuator port.
7. The system of claim 6 , wherein a length of the actuator port arm of the first microsorter is different from a length of the actuator port arm of the second microsorter.
8. The system of claim 6 , wherein the branched switching regions of the plurality of microsorters are aligned in a horizontal direction on the substrate.
9. The system of claim 1 , wherein each actuator port comprises a sealed chamber.
10. The system of claim 1 , wherein the actuator packing block includes a layer in the block assembly which compresses each actuator against an independent flexing means to provide pre-stress.
11. The system of claim 1 , wherein the displacement actuators are held in a fixed two-dimensional array having at least two rows.
12. The system of claim 11 , wherein the displacement actuators are held in an array having three rows.
13. The system of claim 10 , wherein the flexing means comprises a helical spring.
14. The system of claim 10 , wherein the flexing means comprises a flexure.
15. The system of claim 1 , wherein each electric connector includes:
a mounting-pin coupled to the piezo-electric stack; and
a conductive coating disposed over the mounting-pin and extending at least partially over the piezo-electric stack to provide an electrical connection to the piezo-electric stack.
16. The system of claim 15 further comprising a socket containing conductive spring-loaded contacts into which the mounting-pin can be inserted such that its insertion into the socket provides electrical contact to the piezo-electric stack.
17. The system of claim 1 , wherein the actuator packing block includes a back plate, wherein the actuators are fixed to the back plate.
18. The system of claim 17 , wherein the actuator packing block further includes a front block mounted to the back plate.
19. The system of claim 18 , wherein the mounting of the front block to the back plate compresses the actuators.
20. The system of claim 19 , wherein each actuator is compressed against a flexible member.
21. The system of claim 1 , wherein each actuator is further coupled to a mounting-pin.
22. The system of claim 21 , wherein each mounting pin extends through an aperture formed in a back plate of the actuator packing block.
23. The system of claim 21 , wherein each mounting-pin conducts electricity from a power source to actuate the stack of piezo-electric elements.
24. The system of claim 1 , wherein each actuation device protrudes through an aperture in a front block of the actuator packing block.
25. The system of claim 1 , wherein the plurality of actuators are arraigned in a staggered relationship.
26. The system of claim 1 , wherein the actuation devices are actuation pins.
27. A system for sorting particles, comprising:
a microfluidic chip containing a plurality of microsorters, each microsorter having an actuation port for interfacing with a displacement actuator for selectively actuating the microsorter to deflect a particle having a predetermined characteristic from a stream of particles, wherein at least one of the actuation ports of a first microsorter is located in a different coordinate along the chip from an actuation port of a second microsorter;
an external actuator packing block holding a plurality of displacement actuators and a plurality of actuation devices such that the location of each actuation device in the block corresponds to the location of an associated actuator port in the microsorter chip when the block and chip are brought together;
wherein each of the plurality of displacement actuators is formed by a plurality of piezo-electric elements in a stacked relationship and each of the plurality of displacement actuators is coupled to a respective one of the plurality of actuation devices; and
wherein each actuation device protrudes through an aperture in a first portion of the actuator packing block.
28. The system of claim 27 , wherein the block provides pre-compression of each displacement actuator in an unexcited state.
29. The system of claim 27 , wherein the actuator packing block includes a layer in the block assembly which compresses each actuator against an independent flexing means to provide pre-stress.
30. The system of claim 29 , wherein the flexing means comprises a helical spring.
31. The system of claim 29 , wherein the flexing means comprises a flexure.
32. The system of claim 27 , wherein the actuator packing block includes a back plate, wherein the actuators are fixed to the back plate.
33. The system of claim 32 , wherein the first portion is mounted to the back plate and the mounting of the first portion to the back plate compresses the actuators.
34. The system of claim 27 , wherein each actuator is compressed against a flexible member.
35. The system of claim 27 , wherein each actuator is further coupled to a mounting-pin.
36. The system of claim 35 , wherein each mounting pin extends through an aperture formed in a back plate of the actuator packing block.
37. The system of claim 35 , wherein each mounting-pin conducts electricity from a power source to actuate the stack of piezo-electric elements.