Resin particle, conductive particle, and anisotropic conductive adhesive containing the same
View Patent ↗Resin particles comprised of an acrylic resin. Not only is the maximum compression deformation ratio thereof as great as 60% or more but also the load required for 60% compression deformation is as small as 60 mN or less. Wiring boards are therefore coupled in using an anisotropic conductive adhesive obtained by first manufacturing conductive particles having a conductive coating formed on a resin particle surface of the resin particles by adhering a conductive material to the surface of the above resin particles as a core. On dispersing the conductive particles in an adhesive material, the conductive particles sandwiched between metallic wires of the wiring boards are greatly deformed by a small load, so that the electrical devices having a high conduction reliability can be obtained.
1. A method for manufacturing a resin particle including preparing a polymer from monomers including a urethane compound and an acrylic acid ester, comprising the steps of;
introducing a treatment liquid under pressure into a liquid medium via a porous membrane, said treatment liquid containing said monomers;
forming a droplet of the treatment liquid in the liquid medium; and
polymerizing the treatment liquid including the droplet to form the resin particle.
2. The method for manufacturing the resin particle according to claim 1 , wherein an acrylic monomer composition added with polymerization initiator is used as the treatment liquid, while water added with a dispersion stabilizer is used as the liquid medium.
3. The method for manufacturing the resin particle according to claim 1 , wherein a SPG membrane is used as the porous membrane.