High-frequency drum-style slip-ring modules
View Patent ↗A drum-style slip-ring module ( 100 ) is used in a contact-type communication system. The module utilizes PCB construction to construct a plurality of stacked electrically-conductive rings ( 102 ) and a plurality of dielectric layers ( 104 ) electrically isolating the conductive rings. Each of the dielectric layers includes a centrally-located aperture ( 107 ). The module also includes a cylindrical ground plane ( 108 ) positioned in the centrally-located aperture. The module is configured to provide electrical connection to each of the rings at an exterior surface of the module. Each group of feed line vias can be designed as impedance-controlled transmission lines with connections to each ring group. The construction described in this invention can create slip-ring transmission line structures with bandwidth from DC to 5 GHz or higher, allowing the slip-ring to be used to transfer multi-gigabit digital data streams.
1. A drum-style slip-ring module, comprising:
a plurality of stacked electrically-conductive rings;
a plurality of dielectric layers electrically isolating the conductive rings,
wherein each of the dielectric layers includes a centrally-located aperture; and
a cylindrical ground plane positioned in the centrally-located aperture,
wherein the module is configured to provide electrical connector to each of the rings at an exterior surface of the module,
wherein each of the rings is coupled to a buried feed line that is coupled to the exterior surface of the module by a feed line via for connection to an external device, and
wherein the rings are grouped into a first ring group and a second ring group each including at least two of the rings, and wherein the module further comprises:
a shield layer coupled between the first ring group and the second ring group, wherein the shield layer is electrically coupled to the cylindrical ground plane.
2. The module of claim 1 , wherein the module is constructed using printed circuit board (PCB) techniques.
3. The module of claim 1 , wherein the slip-ring is optimized for high-frequency performance, having operational bandwidths of several gigahertz.
4. The module of claim 1 , wherein a diameter of the module can be any arbitrary size.