Methods and apparatus having an integrated circuit attached to fused silica
View Patent ↗Disclosed are methods for attaching an integrated circuit to a substrate, and in particular, a fused silica substrate, along with apparatus fabricated using the methods. Exemplary apparatus comprises a glass substrate, a metallic layer disposed on the substrate, and an integrated circuit eutectically bonded to the glass substrate via the metallic layer. The integrated circuit and fused silica substrate form part of a hermetic sensor. In an exemplary sensor, a first trench is formed in a first substrate. A second trench that is deeper than the first trench is formed in the first substrate. A first plurality of electrodes are formed in the first trench. An integrated circuit is attached to the first substrate within the second trench using a solder preform. The integrated circuit may be attached to the first substrate by depositing a Cr/Au film onto either the integrated circuit or first substrate, depositing a Cr/Ni/Au film onto either the first substrate or integrated circuit, placing the an Au/Sn solder preform onto the Cr/Ni/Au film, positioning the integrated circuit on top of the soldered preform so that it contacts the Cr/Au film, and heating the assembly.
1. An apparatus, comprising,
a first glass substrate comprising at least one trench;
a metallic layer disposed on the first glass substrate;
an integrated circuit disposed on the metallic layer and eutectically bonded to the first glass substrate;
at least one first electrode disposed on a surface of the at least one trench;
at least one wire bond connected between the integrated circuit and the at least one first electrode;
a second glass substrate comprising at least one second electrode that cooperates with the at least one first electrode to form a sensor;
at least one electrical feedthrough disposed through the first glass substrate that is coupled to selected ones of the at least one first electrode; and
at least one wire bond connected between the integrated circuit and the at least one electrical feedthrough,
wherein the peripheries of the respective first and second glass substrates are fused together to form a hermetic sensor.
2. The apparatus recited in claim 1 , wherein the metallic layer comprises a solder preform.
3. The apparatus recited in claim 1 , wherein the metallic layer comprises a plurality of layers of metal deposited on the first glass substrate.
4. The apparatus of claim 3 , wherein the integrated circuit is eutectically bonded to the first glass substrate via the plurality of metal layers.
5. The apparatus of claim 1 , wherein the glass substrate comprises a fused silica substrate.
6. The apparatus of claim 1 , wherein the integrated circuit further comprises a first plurality of metal layers which further comprises an adhesion layer and a non-oxidizing layer, wherein the metallic layer disposed on the first glass substrate further comprises a second plurality of metal layers which further comprises an adhesion layer, a wetting layer and a non-oxidizing layer, and wherein a solder alloy preform is placed between the first and second pluralities of metal layers.
7. The apparatus of claim 6 , wherein the substrate, the first and second pluralities of metal layers, the solder preform and the integrated circuit are heated for a predetermined period of time at a predetermined temperature to eutectically bond the integrated circuit to the first glass substrate.
8. The apparatus of claim 7 , wherein the predetermined temperature is between about 100 to about 400 degrees C.
9. The apparatus of claim 8 , wherein the predetermined time period is about 5 minutes.
10. The apparatus of claim 6 , wherein the first plurality of metal layers further comprises a chromium or titanium layer and a gold layer, and wherein the second plurality of metal layers further comprises a chromium or titanium layer, a nickel layer and a gold layer.
11. The apparatus of claim 1 , wherein the integrated circuit further comprises a first plurality of metal layers which further comprises an adhesion layer, a wetting layer and a non-oxidizing layer, wherein the metallic layer disposed on the first glass substrate further comprises a second plurality of metal layers which further comprises an adhesion layer and a non-oxidizing layer, and wherein a solder alloy preform is placed between the first and second pluralities of metal layers.
12. The apparatus of claim 11 , wherein the substrate, the first and second pluralities of metal layers, the solder alloy preform and the integrated circuit are heated for a predetermined time at a predetermined temperature to eutectically bond the integrated circuit to the substrate.
13. The apparatus of claim 12 , wherein the predetermined temperature is between about 100 to about 400 degrees C.
14. The apparatus of claim 13 , wherein the predetermined time period is about 5 minutes.
15. The apparatus of claim 11 , wherein the first plurality of metal layers further comprises a chromium or titanium layer, a nickel layer and a gold layer; and wherein the second plurality of metal layers further comprises a chromium or titanium layer and a gold layer.