Stand-off mounting apparatus for discrete electrical components
View Patent ↗A stand-off mounting apparatus includes an insulative carrier for off-board mounting of leaded or surface-mount components, particularly large temperature-sensitive discrete components such as capacitors. The carrier has a component-mounting surface that is elevated relative to the circuit board, and is positioned with respect to the circuit board such that the circuit board area under the mounting surface of the carrier is available for the placement of smaller non-temperature-sensitive components. The off-board components are mounted on the component-mounting surface of the carrier, and the carrier may include support features for providing additional mechanical support for the components. Electrical leads for electrically coupling the elevated components to the circuit board may be insert-molded in the carrier, or may be inserted into plated through-holes in the carrier.
1. Stand-off mounting apparatus for supporting at least one discrete electrical component and electrically coupling said component to a circuit board, comprising:
an insulative carrier including a platform on which the discrete electrical component is mounted and insulative legs that depend from said platform and mechanically engage said circuit board to support said platform with respect to said circuit board, said platform being elevated off the circuit board, said insulative carrier being formed of a molded plastic body; and
electrical interconnect leads insert molded into the molded plastic body and extending between the insulative carrier and the circuit board for electrically coupling the discrete electrical component to the circuit board.
2. The stand-off mounting apparatus of claim 1 , where:
the electrical interconnect leads are provided with compliant terminals that press into plated through-holes in the circuit board to effect solderless electrical couplings between the interconnect leads and the circuit board.
3. The stand-off mounting apparatus of claim 1 , where:
the electrical interconnect leads terminate in insert-molded lugs that have exposed surfaces on the platform of the insulative carrier; and
the discrete electrical component includes surface-mount terminals that engage the exposed surfaces of the insert-molded lugs to electrically couple the electrical interconnect leads to the surface-mount terminals of the discrete electrical component.
4. The stand-off mounting apparatus of claim 3 , where:
the surface-mount terminals of the discrete electrical component are soldered to the exposed surfaces of the insert-molded lugs; and
the insert molded lugs have additional exposed surfaces for applying heat to junctions between the surface-mount terminals of the discrete electrical component and the insert-molded lugs.
5. The stand-off mounting apparatus of claim 1 , where:
the discrete electrical component includes a mounting block with plated through-hole terminals; and
the insert-molded interconnect leads are provided with compliant terminations that extend out of said platform and press into the plated through-hole terminals of said discrete electrical component to effect solderless electrical couplings between the interconnect leads and the discrete electrical component.
6. The stand-off mounting apparatus of claim 5 , where:
the mounting block of the discrete electrical component is secured to the platform of said insulative carrier.
7. The stand-off mounting apparatus of claim 1 , where:
the platform of the insulative carrier includes component retaining features for mechanically securing the discrete electrical component to the insulative carrier.
8. Stand-off mounting apparatus for supporting at least one discrete electrical component and electrically coupling said component to a circuit board, comprising:
a component jacket mechanically joined to the discrete electrical component;
an insulative carrier including a platform on which the discrete electrical component is mounted and insulative legs that depend from said platform and mechanically engage said circuit board to support said platform with respect to said circuit board, the component jacket being nested within a set of wall segments that extend out of the platform for properly orienting said discrete electrical component on said platform, said platform being elevated off the circuit board, said insulative carrier being formed of a molded plastic body; and
electrical interconnect leads insert molded into the molded plastic body and extending between the insulative carrier and the circuit board for electrically coupling the discrete electrical component to the circuit board.