Piezoelectric device
View Patent ↗A piezoelectric device includes a piezoelectric element, a circuit board on which the piezoelectric element is mounted, an IC component having at least a function of oscillating the piezoelectric element and connected to a bottom face of the circuit board, an insulating section covering at least a part of the IC component, a circuit connection terminal formed on a main surface of the IC component, an internal connection bump formed on the circuit connection terminal and connected to the circuit connection terminal and the bottom face of the circuit board, a functional terminal formed on a main surface of the IC component, a back surface electrode formed on a back surface of the IC component, a penetrating electrode penetrating the IC component from the main surface to the back surface and connecting the functional electrode and the back surface electrode to each other, an external connection bump connected to the back surface electrode, and a mounting terminal formed on a surface of the insulating section, and a part of the external connection bump is exposed from the surface of the insulating section and is connected to the mounting terminal.
1. A piezoelectric device comprising:
a piezoelectric element;
a circuit board on which the piezoelectric element is mounted;
an IC component having at least a function of oscillating the piezoelectric element and connected to a bottom face of the circuit board;
an insulating section covering at least a part of the IC component;
a circuit connection terminal formed on a main surface of the IC component;
an internal connection bump formed on the circuit connection terminal and connected to the circuit connection terminal and the bottom face of the circuit board;
a functional terminal formed on a main surface of the IC component;
a back surface electrode formed on a back surface of the IC component;
a penetrating electrode penetrating the IC component from the main surface to the back surface and connecting the functional electrode and the back surface electrode to each other;
an external connection bump connected to the back surface electrode; and
a mounting terminal formed on a surface of the insulating section,
wherein a part of the external connection bump is exposed from the surface of the insulating section and is connected to the mounting terminal.
2. The piezoelectric device according to claim 1 ,
wherein the mounting terminal formed on the surface of the insulating section is formed using conductive ink and fixed to the insulating section.