Probe contacting electrode and electronic device
View Patent ↗A probe contacting electrode that is formed on a surface of a package of an electronic device and to which a probe of a probe device is contacted, including a lower layer part and an upper layer part made of a softer conductive material than a conductive material that forms the lower layer part.
1. A probe contacting electrode comprising:
a lower layer part; and
an upper layer part made of a softer conductive material than a conductive material that forms the lower layer part;
wherein the electrode is formed on a surface of a package of a piezoelectric device, the piezoelectric device having a frequency, and the electrode is formed such that a probe can contact the electrode to measure the frequency.
2. The probe contacting electrode according to claim 1 , a thickness of the upper layer part is smaller than the thickness of the lower layer part.
3. The probe contacting electrode according to claim 1 , a thickness of the upper layer part is larger than or equal to the thickness of the lower layer part.
4. The probe contacting electrode according to claim 1 , wherein the lower layer part is a lower metal layer formed on the surface of the package, and the upper layer part is an upper metal layer that is made of a soft metal and formed on the lower metal layer.
5. The probe contacting electrode according to claim 4 , wherein the lower metal layer is a metal layer that is hardened by applying pressure, and the upper metal layer is a metal layer that is unpressed.
6. The probe contacting electrode according to claim 4 , wherein the package is made of ceramic, the lower metal layer is a pressed metal layer that is formed by providing a paste-form metal layer on the package and hardening the paste-form metal layer by applying pressure on the layer, the upper metal layer is an unpressed metal layer that is formed by providing a paste-form metal on the lower metal layer, and these metal layers are solidified by baking together with the package.
7. The probe contacting electrode according to claim 6 , wherein the material that forms the metal layers is tungsten or molybdenum.
8. The probe contacting electrode according to claim 1 , wherein the upper layer part is made of a conductive material that is softer than a material that forms the probe.
9. An electronic device, comprising the probe contacting electrode according to claim 1 .
10. The electronic device according to claim 9 , wherein the piezoelectric device is a surface-mounting type piezoelectric device, and the probe contacting electrode is provided on a face of the package and the package is ceramic.
11. The electronic device according to claim 9 , wherein the piezoelectric device is a surface-mounting type piezoelectric oscillator that has an IC part, and the probe contacting electrode is an electrode for inputting data into the IC part that is provided on a face of the package and the package is ceramic.