Graphics card heat-dissipating device
View Patent ↗A graphics card heat-dissipating device includes: a main body, a support seat, and a fixed element. The main body has a first heat-dissipating portion and a second heat-dissipating portion, and the first heat-dissipating portion has a first opening and the second heat-dissipating portion has a second opening. The support seat is used for supporting a chip, and the support seat has a third opening. The fixed element is fixed on the first heat-dissipating portion by passing through the second opening, the third opening and the first opening in sequence for attaching the chip on the first heat-dissipating portion. Therefore, the heat convection function and the heat-dissipating efficiency are increased.
1. A graphics card heat-dissipating device, comprising:
a U-shaped main body having;
a first heat-dissipating portion;
a second heat-dissipating portion;
wherein the first heat-dissipating portion has a first opening and the second heat-dissipating portion has a second opening, the first heat-dissipating portion having a plurality of fins formed on an outside surface thereof, and the second heat-dissipating portion having a plurality of fins formed on an outside surface thereof;
a planar portion being formed on an outside surface between the first heat-dissipating portion and the second heat-dissipating portion for mounting said main body on a planar surface;
a support seat for supporting a chip, the support seat having a third opening; and
a fixed spring biased element being fixed on the first heat-dissipating portion by passing said fixed element through the second opening, the third opening and the first opening for securing the chip against an inner surface of the first heat-dissipating portion.
2. The graphics card heat-dissipating device as claimed in claim 1 , wherein the main body is made of metal material.
3. The graphics card heat-dissipating device as claimed in claim 1 , wherein the main body is a one-piece main body.
4. The graphics card heat-dissipating device as claimed in claim 1 , wherein the second opening is larger than the first opening.
5. The graphics card heat-dissipating device as claimed in claim 1 , wherein the support seat is a PCB (Printed Circuit Board).
6. The graphics card heat-dissipating device as claimed in claim 1 , wherein the fixed element has a fixed portion formed on a front side thereof and fixed on the first heat-dissipating portion, and the fixed element has a spring disposed on a back side thereof.
7. The graphics card heat-dissipating device as claimed in claim 1 , wherein the fixed element is a spring screw.
8. The graphics card heat-dissipating device as claimed in claim 1 , further comprising a wind-guiding cover close to the main body for accelerating heat-dissipating function.
9. The graphics card heat-dissipating device as claimed in claim 1 , wherein the second heat-dissipating portion is separated from said first heat-dissipating portion by an air gap, and said second heat-dissipating portion being formed for providing an additional path for thermal conduction and a path for thermal convection to the air gap.