Seal Material for Semiconductor Production Apparatus
A sealing material for a semiconductor manufacturing apparatus includes as rubber components, 80 to 50% by weight of a tetrafluoroethylene-perfluoroalkylvinylether type perfluoro elastomer (FFKM) and 20 to 50% by weight of a fluoroelastomer (FKM) other than FFKM (where FFKM+FKM=100% by weight).
1 . A sealing material for a semiconductor manufacturing apparatus comprising:
80 to 50% by weight of a
tetrafluoroethylene-perfluoroalkylvinylether type perfluoroelastomer (FFKM); and
20 to 50% by weight of a fluoroelastomer (FKM) other than FFKM (where FFKM+FKM=100% by weight); as rubber components.
2 . The sealing material for a semiconductor manufacturing apparatus according to claim 1 , wherein said sealing material contains substantially no filler.
3 . A composition for preparing a sealing material used in a semiconductor manufacturing apparatus comprising:
a tetrafluoroethylene-perfluoroalkylvinylether type unvulcanized perfluoroelastomer (FFKM);
an unvulcanized fluoroelastomer (FKM) other than the unvulcanized FFKM; and
a crosslinking agent,
wherein the unvulcanized FFKM accounts for 80 to 50% by weight and the unvulcanized FKM accounts for 20 to 50% by weight of 100% by weight of the total amount of the unvulcanized FFKM and the unvulcanized FKM.
4 . The composition for preparing a sealing material used in a semiconductor manufacturing apparatus according to claim 3 , wherein said composition for preparing a sealing material contains substantially no filler.