Active-matrix organic electroluminescent device and method for fabricating the same
View Patent ↗An organic electroluminescent device is provided. A gate line and a data line cross each other to define a pixel region, and a power line crosses the gate line and is arranged parallel to the data line. A switching transistor is disposed at a crossing of the gate line and the data line, a driving transistor is disposed at a crossing of the gate line and the power line, and a pixel electrode is formed in the pixel region. Each of the switching transistor and the driving transistor includes a gate electrode formed under a channel layer, and a stopper on the channel layer.
1. An organic electroluminescent device comprising:
a gate line and a data line crossing each other to define a pixel region;
a power line crossing the gate line and arranged parallel to the data line;
a switching transistor connected to the gate line and the data line;
a driving transistor connected to the gate line and the power line; and
a pixel electrode formed in the pixel region,
wherein each of the switching transistor and the driving transistor includes:
a gate electrode formed under a channel layer, source and drain electrodes on and directly contacting the channel layer, an interlayer insulating layer on and in direct contact with the channel layer and only in an area between the source and drain electrodes and a stopper on and in contact with the interlayer insulating layer, and
wherein the interlayer insulating layer and the stopper are spaced apart from the source and drain electrodes, respectively, between the source electrode and the drain electrode.
2. The device according to claim 1 , wherein the stopper of the driving transistor is electrically connected to a source electrode.
3. The device according to claim 1 , wherein the gate electrodes of the switching transistor and the driving transistor are respectively placed between ohmic contact layers of the channel layer to block light traveling toward the channel layer.
4. The device according to claim 1 , further comprising a first metal layer formed between the stopper and the interlayer insulating layer to block light traveling toward the channel layer.
5. The device according to claim 1 , wherein the stopper is formed of the same material as that of the pixel electrode.
6. The device according to claim 5 , wherein the stopper is formed of an indium tin oxide metal.
7. The device according to claim 1 , wherein the source electrode of the driving transistor overlaps a storage electrode with another interlayer insulating layer and another channel layer.
8. The device according to claim 7 , wherein the source electrode is electrically connected to the storage electrode.
9. The device according to claim 1 , further comprising a second metal layer formed between the pixel electrode and another interlayer insulating layer to block light traveling toward the channel layer.
10. A method for fabricating an organic electroluminescent device, the method comprising:
forming a first gate electrode, a second gate electrode, and a storage electrode on a substrate;
forming a gate insulating layer and first to third channel layers on the first and second gate electrodes and the storage electrode;
forming an interlayer insulating layer and a transparent metal sequentially on the substrate including the first to third channel layers, and etching the resulting structure to form first and second interlayer insulating patterns, a pixel electrode and first and second stoppers; and
forming first source/drain electrodes on and in direct contact with the channel layer corresponding to the first gate electrode, second source/drain electrodes on and in direct contact with the channel layer corresponding to the second gate electrode, a data line, and a power line on the substrate including the first and second stoppers,
wherein the first interlayer insulating pattern is formed on and in direct contact with the first channel layer and only in an area between the first source/drain electrodes, and the first stopper is formed on and in contact with the first interlayer insulating pattern, and
wherein the first interlayer insulating pattern and the first stopper are spaced apart from the first source/drain electrodes, respectively, between the first source electrode and the first drain electrode.
11. The device according to claim 1 , wherein the interlayer insulating layer is formed between the channel layer and the stopper.
12. The device according to claim 1 , wherein each of the switching transistor and the driving transistor further includes a gate insulating layer on the gate electrode, wherein the interlayer insulating layer is spaced apart from the gate electrode with the gate insulting layer and the channel layer therebetween.
13. A method for fabricating an organic electroluminescent device, the method comprising:
forming a gate electrode and a storage electrode on a substrate;
forming a gate insulating layer and a channel layer on the gate electrode and the storage electrode;
forming an interlayer insulating layer and a transparent metal sequentially on the substrate including the channel layer, and etching the resulting structure to form an interlayer insulating pattern, a pixel electrode and a stopper; and
forming source/drain electrodes on and in direct contact with the channel layer, a data line and a power line on the substrate including the stopper,
wherein the interlayer insulating pattern is formed on and in direct contact with the channel layer and only in an area between the source and drain electrodes, and the stopper is formed on and in contact with the interlayer insulating pattern, and
wherein the interlayer insulating layer and the stopper are spaced apart from the source and drain electrodes, respectively, between the source electrode and the drain electrode.
14. The method according to claim 13 , further comprising performing an ion implantation process using the stopper as a mask for formation of an ohmic contact layer in the channel layer after the forming of the stopper.
15. The method according to claim 13 , further comprising forming a metal layer for light blocking between the interlayer insulating layer and the transparent metal.
16. The method according to claim 13 , wherein the stopper is formed at a portion of the channel layer corresponding to the gate electrode.
17. The method according to claim 13 , wherein the source electrode is electrically connected to the stopper.
18. The method according to claim 13 , wherein the stopper is formed of the same material as that of the pixel electrode.
19. The method according to claim 13 , wherein the stopper is formed of an indium tin oxide metal.
20. The method according to claim 10 , wherein the second interlayer insulating pattern is formed on and in contact with the second channel layer and between the second source electrode and second drain electrode, and the second stopper is formed on and in contact with the second interlayer insulating pattern, and
wherein the second interlayer insulating pattern and the second stopper are spaced apart from the second source/drain electrodes, respectively, between the second source electrode and the second drain electrode.
21. The method according to claim 10 , further comprising performing an ion implantation process using the first and second stoppers as a mask for formation of an ohmic contact layer in the first to second channel layers after the forming of first and second stoppers.
22. The method according to claim 10 , further comprising forming a metal layer for light blocking between the interlayer insulating layer and the transparent metal.
23. The method according to claim 10 , wherein the first and second stoppers are formed at positions of the first to second channel layers corresponding to the first and second gate electrodes, respectively.
24. The method according to claim 10 , wherein the second source electrode is electrically connected to the second stopper.
25. The method according to claim 10 , wherein the first and second stoppers are formed of the same material as that of the pixel electrode.
26. The method according to claim 10 , wherein the first and second stoppers are formed of an indium tin oxide metal.