Providing an embedded capacitor in a circuit board
View Patent ↗A circuit board includes power reference layers and a capacitor provided between the power reference layers such that a shorter dimension of the capacitor defines a space between the power reference layers. The capacitor has plural conductive plates and plural dielectric layers.
1. A circuit board comprising:
power reference layers; and
a capacitor provided between the power reference layers, wherein the capacitor has at least a first dimension and a second dimension that is larger than the first dimension, wherein the capacitor is positioned such that the first dimension defines a distance between the power reference layers, and wherein the capacitor comprises:
plural conductive plates sandwiching plural dielectric layers; and
a first conductive electrode electrically connected to a first subset of the plural conductive plates and facing a first of the power reference layers; and
a second conductive electrode electrically connected to a second subset of the plural conductive plates and facing a second of the power reference layers,
wherein the first conductive electrode and second conductive electrode extend in a direction that is generally parallel to the power reference layers, and
wherein the conductive plates are generally parallel to the first and second conductive electrodes, wherein the first conductive electrode is attached to one of the plural conductive plates, and wherein the second conductive electrode is attached to another of the plural conductive plates, wherein a surface of the first conductive electrode is contacted to one of the power reference layers, and a surface of the second conductive electrode is contacted to another one of the power reference layers.
2. The circuit board of claim 1 , wherein the capacitor further comprises a housing in which the plural conductive plates and dielectric layers are contained.
3. The circuit board of claim 1 , wherein the power reference layers comprise a power supply voltage reference layer and a ground reference layer.
4. The circuit board of claim 1 , wherein the plural conductive plates and plural dielectric layers provide multiple assemblies associated with corresponding capacitances, wherein each of the assemblies includes a conductive plate from the first subset, a conductive plate from the second subset, and a dielectric layer, and wherein an overall capacitance of the capacitor is collectively provided by the capacitances of the assemblies.
5. The circuit board of claim 1 , wherein the first conductive electrode is plated to one of the plural conductive plates, and the second conductive electrode is plated to another of the plural conductive plates.
6. The circuit board of claim 1 , wherein the first subset of conductive plates are electrically interconnected, and the second subset of conductive plates are electrically interconnected.
7. The circuit board of claim 6 , wherein the capacitor further comprises a first end cap and a second end cap, and wherein the first end cap electrically interconnects the first subset of conductive plates, and the second end cap electrically interconnects the second subset of conductive plates, wherein the first and second end caps are distinct from the first and second conductive electrodes.
8. The circuit board of claim 7 , further comprising insulating layers attached to the end caps to electrically isolate the end caps.
9. The circuit board of claim 1 , wherein the capacitor has a length and a width, and wherein the capacitor is laid on its side between the power reference layers.
10. The circuit board of claim 1 , further comprising a dielectric layer between the power reference layers, wherein the capacitor is embedded in the dielectric layer.
11. The circuit board of claim 10 , wherein the dielectric layer has multiple openings, and wherein the capacitor is embedded in one of the openings of the dielectric layer, the circuit board further comprising additional capacitors embedded in other openings of the dielectric layer, the additional capacitors electrically connected between the power reference layers.
12. The circuit board of claim 1 , wherein the surface of the first conductive electrode is directly physically contacted to the one of the power reference layers, and the surface of the second conductive electrode is directly physically contacted to the another one of the power reference layers.