IP Library Granted Patent US 7,812,338
Granted Patent B2
US 7,812,338 · App. 11/822,447 · Granted Oct 12, 2010

Semiconductor light emitting device

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Quick Facts
Patent No.
US 7,812,338
App. No.
11/822,447
Granted
Oct 12, 2010
Kind
B2
Abstract

A semiconductor light emitting device may include an n-type contact layer on a substrate. An active layer may be on the n-type contact layer and/or include two or more quantum well layers and two or more barrier layers. A p-type contact layer may be on the active layer. Energy band gaps of the quantum well layers may be larger as the quantum well layers are closer to the n-type contact layer from the p-type contact layer, thicknesses of the quantum well layers may be smaller as the quantum well layers are closer to the n-type contact layer from the p-type contact layer, and/or energy band gaps of the barrier layers may be larger as the barrier layers are closer to the n-type contact layer from the p-type contact layer.

Claims (56)

1. A semiconductor light emitting device, the device comprising:

an n-type contact layer on a substrate;

an active layer on the n-type contact layer and including two or more quantum well layers and two or more barrier layers; and

a p-type contact layer on the active layer,

wherein the energy band gaps of the quantum well layers are larger as the quantum well layers are closer to the n-type contact layer from the p-type contact layer, and

if numbers are allocated from the quantum well layer closest to the n-type contact layer to the quantum well layer closest to the p-type contact layer, an atomic percentage of indium of an Nth quantum well layer is about 5-20% less than an atomic percentage of indium of an (N+1)th quantum well layer.

2. A semiconductor light emitting device, the device comprising:

an n-type contact layer on a substrate;

an active layer on the n-type contact layer and including two or more quantum well layers and two or more barrier layers; and

a p-type contact layer on the active layer,

wherein thicknesses of the quantum well layers change as the quantum well layers are closer to the n-type contact layer from the p-type contact layer, and

if numbers are allocated from the quantum well layer closest to the n-type contact layer to the quantum well layer closest to the p-type contact layer, a thickness of an Nth quantum well layer is about 5-20% less than a thickness of an (N+1)th quantum well layer.

3. A semiconductor light emitting device, the device comprising:

an n-type contact layer on a substrate;

an active layer on the n-type contact layer and including two or more quantum well layers and two or more barrier layers; and

a p-type contact layer on the active layer,

wherein energy band gaps of the barrier layers change as the barrier layers are closer to the n-type contact layer from the p-type contact layer, and

if numbers are allocated from the barrier layer closest to the n-type contact layer to the barrier layer closest to the p-type contact layer, an atomic percentage of indium of an Nth barrier layer is about 5-20% less than an atomic percentage of indium of an (N+1)th barrier layer.

4. The device of claim 1 , wherein

the quantum well layers are In x Ga 1-x N layers, and

x is a number greater than or equal to 0.05 and less than or equal to 0.5.

5. The device of claim 1 , wherein thicknesses of the quantum well layers are smaller as the quantum well layers are closer to the n-type contact layer from the p-type contact layer.

6. The device of claim 5 , wherein if numbers are allocated from the quantum well layer closest to the n-type contact layer to the quantum well layer closest to the p-type contact layer, a thickness of an Nth quantum well layer is about 5-20% less than a thickness of an (N+1)th quantum well layer.

7. The device of claim 1 , wherein energy band gaps of the barrier layers are larger as the barrier layers are closer to the n-type contact layer from the p-type contact layer.

8. The device of claim 1 , wherein

the barrier layers are In y Ga 1-y N layers, and

y is a number greater than or equal to 0 and less than or equal to 0.1.

9. The device of claim 8 , wherein the amount of indium in the barrier layers is smaller as the barrier layers are closer to the n-type contact layer from the p-type contact layer.

10. The device of claim 9 , wherein if numbers are allocated from the barrier layer closest to the n-type contact layer to the barrier layer closest to the p-type contact layer, an atomic percentage of indium of an Nth barrier layer is about 5-20% less than an atomic percentage of indium of an (N+1)th barrier layer.

11. The device of claim 1 , further comprising:

an electron blocking layer between the active layer and the p-type contact layer.

12. The device of claim 2 , wherein

the quantum well layers are In x Ga 1-x N layers, and

x is a number greater than or equal to 0.05 and less than or equal to 0.5.

13. The device of claim 12 , wherein an amount of indium in the quantum well layers is smaller as the quantum well layers are closer to the n-type contact layer from the p-type contact layer.

14. The device of claim 13 , wherein if numbers are allocated from the quantum well layer closest to the n-type contact layer to the quantum well layer closest to the p-type contact layer, an atomic percentage of indium of an Nth quantum well layer is about 5-20% less than an atomic percentage of indium of an (N+1)th quantum well layer.

15. The device of claim 2 , wherein energy band gaps of the barrier layers are larger as the barrier layers are closer to the n-type contact layer from the p-type contact layer.

16. The device of claim 2 , wherein

the barrier layers are In y Ga 1-y N layers, and

y is a number greater than or equal to 0 and less than or equal to 0.1.

17. The device of claim 16 , wherein an amount of indium in the barrier layers is smaller as the barrier layers are closer to the n-type contact layer from the p-type contact layer.

18. The semiconductor light emitting device of claim 17 , wherein if numbers are allocated from the barrier layer closest to the n-type contact layer to the barrier layer closest to the p-type contact layer, an atomic percentage of indium of an Nth barrier layer is about 5-20% less than an atomic percentage of indium of an (N+1)th barrier layer.

19. The semiconductor light emitting device of claim 2 , further comprising:

an electron blocking layer between the active layer and the p-type contact layer.

20. The device of claim 3 , wherein energy band gaps of the barrier layers are larger as the barrier layers are closer to the n-type contact layer from the p-type contact layer.

21. The device of claim 20 , wherein

the barrier layers are In y Ga 1-y N layers,

and y is greater than or equal to 0 and less than or equal to 0.1.

22. The device of claim 20 , wherein if numbers are allocated from the quantum well layer closest to the n-type contact layer to the quantum well layer closest to the p-type contact layer, a thickness of an Nth quantum well layer is about 5-20% less than a thickness of an (N+1)th quantum well layer.

23. The device of claim 20 , wherein

the quantum well layers are In x Ga 1-x N layers, and

x is a number greater than or equal to 0.05 and less than or equal to 0.5.

24. The device of claim 23 , wherein the amount of indium in the quantum well layers is smaller as the quantum well layers are closer to the n-type contact layer from the p-type contact layer.

25. The device of claim 24 , wherein if numbers are allocated from the quantum well layer closest to the n-type contact layer to the quantum well layer closest to the p-type contact layer, an atomic percentage of indium of an Nth quantum well layer is about 5-20% less than an atomic percentage of indium of an (N+1)th quantum well layer.

26. The device of claim 20 , further comprising:

an electron blocking layer between the active layer and the p-type contact layer.

Assignments (3)
MERGER Recorded Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 21, 2010
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024263/0502 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 6, 2007
From: RYU, HAN-YOUL
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 019578/0754 →