Perspective switching optical device for 3D semiconductor inspection
An optical system for camera-based 3D inspection of semiconductor devices that provides two different perspectives of a device by switching the color of the light source is disclosed. The system presents a camera with a first view when one color of light is on, and a different perspective view when a different color of light is on.
1 . An optical switch for sequentially switching the viewing perspective that an electronic camera sees when looking through the switch, said switch comprising:
a) a first light source capable of emitting light of a specific first frequency range having at least one frequency not contained in a second light source,
b) a said second light source capable of emitting light of a specific second frequency range having at least one frequency not contained in said first light source,
c) a first reflecting surface for folding a first optical path,
d) a frequency specific reflecting surface that transmits a frequency of light produced by said first light source but not produced said second light source and that reflects a frequency of light produced by said second light source but not produced said first light source,
e) a second reflecting surface for folding a second optical path so as to substantially intersect with said first optical path and simultaneously intersect with said frequency specific reflecting surface,
f) positioning said frequency specific reflecting surface so as to combine said first and said second optical paths,
g) arranging said first and second reflecting surfaces so the distances traveled by each optical path is substantially equivalent.
2 . An optical switch as in claim 1 where said first reflecting surface and said frequency specific reflecting surface are fixed but the location and tilt of said second reflecting surface is adjustable so that the perspective angle and the beam path length of the corresponding optical path can be adjusted.
3 . An optical switch as in claim 1 wherein a frequency corrective filter is placed in the second optical path.
4 . A method for sequentially switching the viewing perspective that an electronic camera sees without moving optics or the camera but by energizing different light sources, said method comprising:
a) illuminating an inspection area with a first light source capable of emitting light of a first frequency not contained in a second light source while not illuminating said inspection area with a second light source, said second light source capable of emitting light having at least one frequency not contained in said first light source,
b) positioning a first reflecting surface for folding a first optical path,
c) positioning a frequency specific reflecting surface that substantially transmits a frequency of light from said first light source but substantially reflects a frequency of light from said second light source,
d) positioning a camera and lens to image an object in the inspection area,
e) positioning a second reflecting surface for folding a second optical path so as to substantially intersect with said first optical path at the location of said frequency specific reflecting surface,
f) acquiring an image of said object with said first light source providing a first perspective,
g) ceasing to illuminate said inspection area with said first light source and begin illuminating inspection area with said second light source,
h) acquiring an image of said object with said second light source providing a second perspective.
5 . The method of claim 4 which includes arranging said first and second reflecting surfaces so that the distances traveled by each optical path is substantially equivalent.
6 . The method of claim 4 that is used to obtain stereo images of electronic semiconductor devices in order to measure the position of electrical contacts in three-dimensions.
7 . An optical system for 3D measurement inspection of electronic semiconductor devices comprising an optical switch for sequentially switching the viewing perspective that an electronic camera sees when looking through the switch, said switch comprising:
a) a first light source capable of emitting a first frequency of light substantially not contained in a second light source,
b) a said second light source capable of emitting a second frequency of light substantially not contained in said first light source,
c) a first reflecting surface for folding a first optical path,
d) a frequency specific reflector placed in said first optical path wherein said reflector substantially transmits said first frequency of light produced by said first light source and that substantially reflects said frequency of light produced by said second light,
e) a second reflecting surface for folding a second optical path so as to substantially intersect with said first optical path,
f) positioning said frequency specific reflector at the intersection of said first and second optical paths and angled so as to combine said first and said second optical paths,
g) arranging said first and second reflecting surfaces and said frequency specific reflector so that the distances traveled by each optical path is substantially equivalent.
8 . An optical system as in claim 7 where said first reflecting surface and said frequency specific reflector are fixed but the location and tilt of said second reflecting surface is adjustable so that the perspective angle and the beam path length of the corresponding optical path can be easily adjusted.
9 . An optical system as in claim 7 that further comprises a frequency corrective filter in the second optical path.
10 . An optical system as in claim 7 for measuring features of a BGA semiconductor device in 3-dimensions using triangulation.
11 . A method for 3D measurement inspection of electronic semiconductor devices by sequentially obtaining stereo viewing perspectives by sequentially energizing different light sources, said method comprising:
a) illuminating an electronic semiconductor device with a first light source capable of emitting light of a first frequency not contained in a second light source while not illuminating said electronic semiconductor device with a second light source, said second light source capable of emitting light having at least one frequency not contained in said first light source,
b) positioning a first reflecting surface for folding a first optical path,
c) positioning a frequency specific reflecting surface that substantially transmits a frequency of light from said first light source but substantially reflects a frequency of light from said second light source,
d) positioning a camera and lens to image said electronic semiconductor device,
e) positioning a second reflecting surface for folding a second optical path so as to substantially intersect with said first optical path at the location of said frequency specific reflecting surface,
f) acquiring an image of said device with said first light source providing a first perspective,
g) stop illuminating said inspection area with said first light source and begin illuminating inspection area with said second light source,
h) acquiring an image of said device with said second light source providing a second perspective.
12 . The method of claim 11 which includes arranging said first and second reflecting surfaces so the distances traveled by each optical path is substantially equivalent.
13 . A method for 3D measurement inspection of electronic semiconductor devices by obtaining stereo viewing perspectives by utilizing different light sources, said method comprising:
a) illuminating an electronic semiconductor device with light,
b) positioning a first reflecting surface for folding a first optical path,
c) positioning a second reflecting surface for folding a second optical path so as to substantially intersect with said first optical path,
d) positioning a frequency specific reflecting surface that substantially transmits a frequency of light while simultaneously substantially reflecting a different frequency of light, said frequency specific reflecting surface being positioned at the intersection of said first and second optical paths and angled so as to combine said first and said second optical paths,
e) positioning a color camera and lens to image said electronic semiconductor device along said combined optical paths,
f) acquiring from said color camera an image of one color field corresponding to said transmitted frequency of light,
g) acquiring from said color camera an image of another color field corresponding to said reflected frequency of light,
h) arranging said first and second reflecting surfaces so that the distances traveled by each optical path is substantially equivalent and thus in focus to the camera.
14 . The method of claim 13 wherein the light source is strobed so that both perspective images of devices can be taken while the device is in motion.