IP Library Granted Patent US 7,351,090
Granted Patent B1
US 7,351,090 · App. 11/830,674 · Granted Apr 1, 2008

Latching mechanism for a module

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Quick Facts
Patent No.
US 7,351,090
App. No.
11/830,674
Granted
Apr 1, 2008
Kind
B1
Abstract

A latching mechanism for use in selectively securing a module within a receptacle of a host device. In one example embodiment, a latching mechanism includes a bail and a latch attached to the bail. The bail is configured to be attached to a shell of a module and to rotate about a first axis between a latched position and an unlatched position. The first axis is in a fixed position relative to the shell. The latch is attached to the bail at a second axis that is offset from the first axis. The latch is configured to rotate about the second axis. The second axis is movable relative to the shell.

Claims (37)

1. A latching mechanism comprising:

a bail configured to be attached to a shell of a module, the bail configured to rotate about a first axis between a latched position and an unlatched position, the first axis being in a fixed position relative to the shell; and

a latch attached to the bail at a second axis that is offset from the first axis, the latch configured to rotate about the second axis, the second axis being movable relative to the shell.

2. The latching mechanism as recited in claim 1 , wherein the latch includes a pin configured to releasably engage a corresponding structure of a host device when the bail is in the latched position, the pin further being configured to disengage from the corresponding structure when the bail is rotated from the latched position to the unlatched position.

3. The latching mechanism as recited in claim 1 , wherein the bail defines a protrusion configured and arranged to releasably engage a recess defined in the shell.

4. The latching mechanism as recited in claim 1 , wherein the bail defines a recess configured and arranged to releasably engage a protrusion defined in the shell.

5. A module comprising:

a shell including a cross bar;

a PCB at least partially positioned within the shell;

a TOSA electrically coupled to the PCB;

a ROSA electrically coupled to the PCB; and

a latching mechanism comprising:

a bail attached to the shell, the bail configured to rotate about a first axis between a latched position and an unlatched position, the first axis being in a fixed position relative to the shell; and

a latch attached to the bail at a second axis that is offset from the first axis, the latch configured to rotate about the second axis, the second axis being movable relative to the shell.

6. The module as recited in claim 5 , wherein the latch includes a pin configured to engage a corresponding structure of a host device when the bail is in the latched position, the pin further being configured to disengage from the corresponding structure when the bail is rotated from the latched position to the unlatched position.

7. The module as recited in claim 5 , wherein the bail includes a visible indicator that provides information concerning a characteristic of the module.

8. The module as recited in claim 7 , wherein the visible indicator comprises at least one of a color or one or more characters.

9. The module as recited in claim 7 , wherein the characteristic of the module includes one of data rate, wavelength, communication protocol, form factor, manufacturer, or vendor of the module.

10. The module as recited in claim 5 , wherein the latching mechanism includes a pair of visible indicators that each provide information concerning a data direction of a corresponding optical port of the module.

11. The module as recited in claim 5 , wherein the bail defines a protrusion configured to engage a corresponding recess of the shell when the bail is in the latched position, such that the bail is releasably secured in the latched position.

12. The module as recited in claim 5 , wherein the latch further includes a knuckle configured to push against a leading edge of a receptacle of a host device when the second axis is rotated about the first axis as the bail is rotated from the latched position to the unlatched position.

13. The module as recited in claim 5 , wherein the latch is further configured to slide against and rotate about the cross bar, as the bail is rotated from the latched position to the unlatched position, such that the pin is retracted within the shell.

14. The module as recited in claim 13 , wherein a portion of the latch is further configured to slide in a positive z-direction against the cross bar when the bail is rotated from the latched position to the unlatched position.

15. The module as recited in claim 5 , wherein the module is substantially compliant with the SFP+ (IPF) MSA.

16. A module comprising:

a shell including a cross bar;

a PCB at least partially positioned within the shell;

a TOSA electrically coupled to the PCB;

a ROSA electrically coupled to the PCB; and

a latching mechanism comprising:

a bail attached to the shell, the bail configured to rotate about a first axis between a latched position and an unlatched position, the first axis being in a fixed position relative to the shell;

a latch attached to the bail at a second axis that is offset from the first axis, the latch configured to rotate about the second axis, the second axis being movable relative to the shell; and

a spring attached to the latch, the spring configured to engage a corresponding surface of the shell such that a pin of the latch is biased to extend from the shell when the bail is in the latched position, the spring also configured to allow the pin to be resiliently retained within the shell when the bail is in the latched position.

17. The module as recited in claim 16 , wherein the pin is configured to engage a corresponding structure of a host device when the bail is in the latched position, the pin further being configured to disengage from the corresponding structure when the bail is rotated from the latched position to the unlatched position.

18. The module as recited in claim 16 , wherein the latching mechanism includes a visible indicator that provides information concerning a characteristic of the module.

19. The module as recited in claim 16 , wherein the bail defines a protrusion configured to engage a recess defined in the shell when the bail is in the latched position, such that the bail is releasably secured in the latched position.

20. The module as recited in claim 16 , wherein the latch further includes a knuckle configured to push against a leading edge of the receptacle of the host device into which the module is positioned as the bail is rotated from the latched position to the unlatched position.

Assignments (7)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
RELEASE OF SECURITY INTEREST Recorded Oct 6, 2016
From: WELLS FARGO CAPITAL FINANCE, LLC
To: FINISAR CORPORATION; OPTIUM CORPORATION; AZNA LLC; FINISAR SALES, INC.; KAILIGHT PHOTONICS, INC.
Reel/Frame 040248/0860 →
SECURITY AGREEMENT Recorded Nov 10, 2009
From: FINISAR CORPORATION; OPTIUM CORPORATION; AZNA LLC; FINISAR SALES, INC.; KAILIGHT PHOTONICS, INC.
To: WELLS FARGO FOOTHILL, LLC, AS AGENT
Reel/Frame 023486/0741 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 6, 2007
From: MOORE, JOSHUA
To: FINISAR CORPORATION
Reel/Frame 019927/0770 →