HID lamp with frit seal thermal control
View Patent ↗A method of making an HID lamp and an HID lamp that includes a ceramic envelope with a ceramic capillary, wherein the capillary has an electrode feed-through therein that is sealed inside the capillary by a frit seal that extends inside the capillary a first distance from a distal end of the capillary, and a ceramic heat sink around at least half an external diameter of the capillary, wherein the heat sink is separated from the envelope and from the distal end of the capillary and the heat sink is in thermally conductive contact with the capillary and has an external diameter at least 1.5 times the external diameter of the capillary. In one preferred embodiment, the heat sink does not overlap the frit seal.
1. A high intensity discharge lamp, comprising:
a ceramic envelope with a ceramic capillary, said capillary having an electrode feed-through therein that is sealed inside said capillary by a frit seal that extends inside said capillary a first distance from a distal end of said capillary; and
a ceramic heat sink around at least half an external diameter of said capillary, said heat sink being separated from said envelope and from said distal end of said capillary, said heat sink being in thermally conductive contact with said capillary and having an external diameter at least 1.5 times the external diameter of said capillary.
2. The lamp of claim 1 , wherein said heat sink is separated from said distal end of said capillary by more than the first distance so that said heat sink does not overlap said frit seal.
3. The lamp of claim 1 , wherein said heat sink overlaps a portion of said frit seal.
4. The lamp of claim 1 , wherein said heat sink extends around an entirety of the external diameter of said capillary.
5. The lamp of claim 1 , wherein said heat sink extends only partially around the external diameter of said capillary.
6. The lamp of claim 1 , wherein the external diameter of said heat sink is 2 to 3 times the external diameter of said capillary.
7. The lamp of claim 1 , wherein said heat sink extends 20% to 80% of a length of said capillary from said envelope to said distal end.
8. The lamp of claim 1 , wherein said heat sink is a sleeve that has a length along said capillary that is greater than the external diameter of said heat sink.
9. The lamp of claim 1 , wherein said heat sink is a ring that has a length along said capillary that is less than the external diameter of said heat sink.
10. The lamp of claim 1 , wherein said heat sink is a coil wound around said capillary.
11. The lamp of claim 1 , further comprising more than one said heat sink, which are separated from each other along said capillary.
12. The lamp of claim 1 , wherein said heat sink is made of a same material as said capillary and is integral therewith.
13. The lamp of claim 1 , wherein said heat sink is multilayered with an inner-most layer that has a same coefficient of thermal expansion as said capillary and an outer-most layer that has a different coefficient of thermal expansion.
14. A method of making a high intensity discharge lamp, comprising the steps of:
providing a ceramic envelope that has a ceramic capillary;
sealing an electrode feedthrough inside said capillary with a frit seal that extends inside said capillary a first distance from a distal end of said capillary;
selecting a size for a ceramic heat sink and a location for said heat sink on said capillary based on a temperature profile of said envelope and said capillary in order to reduce a temperature of said frit seal during operation of the lamp; and
attaching said heat sink of the selected size around at least half an external diameter of said capillary at the selected location, said heat sink being separated from said envelope and from said distal end of said capillary, said heat sink being in thermally conductive contact with said capillary and having an external diameter at least 1.5 times the external diameter of said capillary.
15. The method of claim 14 , wherein the selected location for said heat sink is more than the first distance so that said heat sink does not overlap said frit seal.
16. The method of claim 14 , wherein the selected size for said heat sink is annular so that said heat sink extends around an entirety of the external diameter of said capillary.
17. The method of claim 14 , further comprising the step of attaching more than one said heat sink, which are separated from each other along said capillary.
18. The method of claim 14 , wherein said heat sink is fitted onto said capillary in a green state, presintered to remove a binder, and then sintered to attach said heat sink to said capillary in said attaching step.
19. The method of claim 14 , wherein said envelope, capillary, heat sink are made of a same material and molded at a same time from a common mold in said providing and attaching steps.