Semiconductor device
View Patent ↗A logic circuit in a system LSI is provided with a power switch so as to cut off the switch at the time of standby, reducing leakage current. At the same time, an SRAM circuit of the system LSI controls a substrate bias to reduce leakage current.
1. A semiconductor device comprising:
a first memory circuit including a plurality of first SRAM cells;
a second memory circuit including a plurality of second SRAM cells;
a first power line which supplies a first voltage to the first memory circuit and the second memory circuit; and
a first switch circuit coupled between the first memory circuit and the first power line;
wherein the second memory circuit is directly coupled to the first power line, and
wherein while a power supply of the first voltage to the plurality of first SRAM cells is cut off by the first switch circuit, the plurality of second SRAM cells are supplied with the first voltage from the first power line.
2. A semiconductor device according to claim 1 , further comprising:
a control circuit which controls substrate voltages of MIS transistors of the plurality of second SRAM cells.
3. A semiconductor device according to claim 2 ,
wherein the control circuit is not coupled to the first memory circuit.
4. A semiconductor device according to claim 2 ,
wherein while the first switch circuit is in an off status, the control circuit controls the substrate voltages so as to reduce leakage current of the MIS transistors of the plurality of second SRAM cells.
5. A semiconductor device according to claim 1 , further comprising:
a bus coupled between the first memory circuit and the second memory circuit,
wherein a part of information held in the plurality of first SRAM cells is transferred to the plurality of second SRAM cells before the first switch circuit is changed to the off status.
6. A semiconductor device according to claim 1 ,
wherein a threshold voltage of each of MIS transistors of the plurality of first SRAM cells is smaller than a threshold voltage of each of MIS transistors of the plurality of second SRAM cells.
7. A semiconductor device according to claim 6 ,
wherein a thickness of a gate insulating film of each of the MIS transistors of the plurality of first SRAM cells is less than a thickness of a gate insulating film of each of the MIS transistors of the plurality of second SRAM cells.
8. A semiconductor device according to claim 1 ,
wherein a thickness of a gate insulating film of each of MIS transistors of the plurality of first SRAM cells is less than a thickness of a gate insulating film of each of MIS transistors of the plurality of second SRAM cells.
9. A semiconductor device according claim 1 , further comprising:
a logic circuit to access the first and second memory circuits; and
a second switch circuit coupled between the first power line and the logic circuit,
wherein while the first switch circuit is in off status, the second switch circuit is in off status.