IP Library Granted Patent US 7,581,815
Granted Patent B2
US 7,581,815 · App. 11/834,635 · Granted Sep 1, 2009

Printhead assembly with two-material supporting structure

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Quick Facts
Patent No.
US 7,581,815
App. No.
11/834,635
Granted
Sep 1, 2009
Kind
B2
Abstract

The present invention relates to a printhead assembly. The printhead assembly includes a support beam. The support beam includes two types of material having different coefficients of thermal expansion. A plurality of spaced apart printhead modules is supported by the support beam.

Claims (8)

1. A printhead assembly comprising:

a support beam including two types of material having different coefficients of thermal expansion; and

a plurality of spaced apart printhead modules supported by the support beam, wherein

the support beam is a hot rolled, three-layer laminate, the outer layers of the three-layer laminate being formed from Invar, and

a central layer of the three-layer laminate has a coefficient of thermal expansion greater than Invar, whereby the support beam has an overall coefficient of thermal expansion substantially equal to that of silicon.

2. A printhead assembly as claimed in claim 1 , wherein the outer layers are of the same thickness.

3. A printhead assembly as claimed in claim 1 , wherein the support beam is formed from two different materials bonded together, end to end.

4. A printhead assembly as claimed in claim 3 , wherein one of the materials has a coefficient of thermal expansion less than that of silicon and the other material has a coefficient of thermal expansion greater than that of silicon.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 18, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028581/0269 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 6, 2007
From: SILVERBROOK, KIA
To: SILVERBROOK RESEARCH PTY LTD
Reel/Frame 019654/0524 →