Method and apparatus for fastening two coplanar edges without a weld
View Patent ↗A method and apparatus for fastening two substantially coplanar edges without a weld is disclosed. The method includes: configuring a dovetail feature on a first edge; configuring a complementary dovetail feature receptacle on a second edge to receive the dovetail feature therein; disposing the dovetail feature within the complementary dovetail receptacle; and swaging an interface defined between the dovetail feature in said first edge and said complementary dovetail feature in the second edge to swage mating edges defining the dovetail feature and the dovetail receptacle at at least six swage contact points. In one embodiment the swaging is with a hollow circle punch.
1. A docking apparatus comprising:
a cassette housing defining a housing cavity for one of a printed circuit board and allowing air flow therethrough;
a dovetail feature configured on a first edge defining said cassette housing;
a complementary dovetail feature receptacle configured on a second edge defining said cassette housing to receive said dovetail feature therein, said dovetail feature being disposed within said complementary dovetail feature receptacle; and
a swaged interface defined between said dovetail feature in said first edge and said complementary dovetail feature receptacle in said second edge, said swaged interface mating edges defining said dovetail feature and said dovetail feature receptacle at at least six swage contact points,
wherein said first and second edges include edges of sides defining one of a tail stock bezel and an air filler book assembly.
2. The apparatus of claim 1 , wherein said dovetail feature and said complementary dovetail feature receptacle includes a three or more sided generously radiused dovetail.
3. The apparatus of claim 1 , wherein said dovetail and said complementary dovetail feature receptacle includes an ovalized dovetail.
4. The apparatus of claim 1 , wherein said swaged interface eliminates at least one of a weld pad area and touch-up associated with a resulting mechanical joint interface between said first and second edges.
5. The apparatus of claim 1 , wherein said swaged interface includes swaging with a hollow circle punch.
6. The apparatus of claim 5 , wherein said interface between said dovetail feature and complementary dovetail feature receptacle includes a space therebetween before said swaging with said hollow circle punch.
7. The apparatus of claim 5 , wherein first edge and said second edge are edges from different substrates to be joined defining said cassette housing.
8. A docking apparatus comprising:
a cassette housing defining a housing cavity for one of a printed circuit board and allowing air flow therethrough;
a dovetail feature configured on a first edge defining said cassette housing;
a complementary dovetail feature receptacle configured on a second edge defining said cassette housing to receive said dovetail feature therein, said dovetail feature being disposed within said complementary dovetail feature receptacle; and
a swaged interface defined between said dovetail feature in said first edge and said complementary dovetail feature receptacle in said second edge, said swaged interface mating edges defining said dovetail feature and said dovetail feature receptacle at at least six swage contact points,
wherein first edge and said second edge are edges from a same substrate defining said cassette housing.
9. A docking apparatus comprising:
a cassette housing defining a housing cavity for one of a printed circuit board and allowing air flow therethrough;
a dovetail feature configured on a first edge defining said cassette housing;
a complementary dovetail feature receptacle configured on a second edge defining said cassette housing to receive said dovetail feature therein, said dovetail feature being disposed within said complementary dovetail feature receptacle; and
a swaged interface defined between said dovetail feature in said first edge and said complementary dovetail feature receptacle in said second edge, said swaged interface mating edges defining said dovetail feature and said dovetail feature receptacle at at least six swage contact points,
wherein said swaging with a hollow circle punch which distributes a load experienced by a resulting mechanical joint interface more uniformly relative to cross pattern swaging.