IP Library Granted Patent US 7,652,292
Granted Patent B2
US 7,652,292 · App. 11/835,877 · Granted Jan 26, 2010

Flexible electronic device and production method of the same

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Quick Facts
Patent No.
US 7,652,292
App. No.
11/835,877
Granted
Jan 26, 2010
Kind
B2
Abstract

A flexible electronic device excellent in heat liberation characteristics and toughness and a production method for actualizing thereof in low cost and with satisfactory reproducibility are provided. A protection film is adhered onto the surface of a substrate on which surface a thin film device is formed. Successively, the substrate is soaked in an etching solution to be etched from the back surface thereof so as for the residual thickness of the substrate to fall within the range larger than 0 μm and not larger than 200 μm. Then, a flexible film is adhered onto the etched surface of the substrate, and thereafter the protection film is peeled to produce a flexible electronic device.

Claims (11)

1. A flexible electronic device, comprising:

a first glass substrate and a second glass substrate, wherein each of said first glass substrate and said second glass substrate has a thin film device disposed on one surface thereof,

wherein said one surface having said thin film device disposed thereon of said first glass substrate and said one surface having said thin film device disposed thereon of said second glass substrate adhere to each other, and said thin film device disposed on said one surface of said first glass substrate and said thin film device disposed on said one surface of said second glass substrate are adhered in direct contact with one another;

wherein a thickness of said first glass substrate is larger than 0 μm and not larger than 200 μm and a thickness of said second glass substrate is larger than 0 μm and not larger than 200 μm; and

a first flexible film is adhered onto a first glass substrate side opposite of said one surface having said thin film device disposed thereon, and a second flexible film is adhered onto a second glass substrate side opposite of said one surface having said thin film device disposed thereon,

wherein both said first flexible film and said second flexible film are made of transparent resin films.

2. The flexible electronic device according to claim 1 , wherein said flexible electronic device is a liquid crystal display device.

3. The flexible electronic device according to claim 2 , further comprising either a polarizing film or a phase difference film which is adhered onto said first flexible film side opposite of said first glass substrate or onto said second flexible film side opposite of said second glass substrate.

4. The flexible electronic device according to claim 2 , further comprising a reflective film which is adhered onto said first flexible film side opposite of said first glass substrate or onto said second flexible film side opposite of said second glass substrate.

5. The flexible electronic device according to claim 1 , wherein said thin film device disposed on said one surface of said first glass substrate is a driver circuit.

6. The flexible electronic device according to claim 5 , wherein said thin film device disposed on said one surface of said second glass substrate is a memory circuit.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 19, 2023
From: GOLD CHARM LIMITED
To: HANNSTAR DISPLAY CORPORATION
Reel/Frame 063383/0154 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 15, 2013
From: NEC CORPORATION
To: GOLD CHARM LIMITED
Reel/Frame 030021/0648 →