IP Library Granted Patent US 7,751,192
Granted Patent B2
US 7,751,192 · App. 11/836,755 · Granted Jul 6, 2010

Heatsink method and apparatus

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Quick Facts
Patent No.
US 7,751,192
App. No.
11/836,755
Granted
Jul 6, 2010
Kind
B2
Abstract

A heatsink having tapered geometry that improves passive cooling efficiency is discussed. A tapered geometry between heatsink heat dissipation elements, as a function of distance along a z-axis opposing gravity, decreases resistance to rarification of passively flowing cooling gas upon heating. Thus, the tapered heatsink elements result in higher velocity of gas flow and increased cooling efficiency of the heatsink. Optionally, the heatsink is made from a thermally conductive polymer allowing the heatsink to be created in complex shapes using injection molding.

Claims (32)

1. An apparatus for heat transfer, comprising:

a connecting member; and

at least two heat exchange elements;

wherein said at least two heat exchange elements are either, integrated into said connecting member or attached to said connecting member;

wherein said at least two heat exchange elements form a trough between them, said trough having a bottom opening and a top opening, wherein at least a portion of said top opening is vertically aligned with at least a portion of said bottom opening; and

wherein cross-sectional area between said heat exchange elements increases as a function of vertical distance along a z-axis, wherein said z-axis aligns with gravity.

2. The apparatus of claim 1 , wherein said apparatus further comprises:

a coating covering substantially all of a at least a portion of any of:

said connecting member; and

said heat exchange elements.

3. The apparatus of claim 2 , wherein said coating comprises a rough surface, wherein said rough surface enhances turbulence of air flowing across said rough surface.

4. The apparatus of claim 1 , wherein at least one of said connecting member and said at least two heat exchange elements comprises any of:

an injection molded material; and

a thermally conductive plastic.

5. The apparatus of claim 1 , wherein said thermally conductive plastic comprises:

a material having a heat transfer coefficient of at least ten W/m-K, where W is heat in Watts, m is distance in meters, and K is temperature in degrees Kelvin.

6. The apparatus of claim 1 , wherein at least one of said heat exchange elements comprises any of:

a fin; and

a post.

7. The apparatus of claim 1 , wherein at least one of said heat exchange elements comprises:

a taper on at least two sides.

8. A method for heat transfer from a heat source, comprising the steps of:

providing a heatsink connected to said heat source;

providing at least two heat exchange elements;

wherein said at least two heat exchange elements are either integrated into said heatsink or attached to said heatsink;

forming a trough between said at least two heat exchange elements, said trough having a bottom opening and a top opening;

vertically aligning at least a portion of said top opening with at least a portion of said bottom opening;

wherein cross-sectional area between said heat exchange elements increases as a function of vertical distance along a z-axis, wherein said z-axis aligns with gravity; and

dissipating heat from a heat source using said heatsink.

9. The method of claim 8 , further comprising the step of:

either directly or indirectly coupling said heatsink to said heat source.

10. The method of claim 8 , wherein said heatsink passively increases airflow.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 6, 2012
From: SENSYS MEDICAL, LIMITED
To: GLT ACQUISITION CORP.
Reel/Frame 028912/0036 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 3, 2012
From: SENSYS MEDICAL, INC.
To: SENSYS MEDICAL, LTD
Reel/Frame 028714/0623 →
LIEN RELEASE Recorded Apr 14, 2009
From: GLENN PATENT GROUP
To: SENSYS MEDICAL, INC.
Reel/Frame 022542/0360 →
LIEN Recorded Jan 20, 2009
From: SENSYS MEDICAL, INC.
To: GLENN PATENT GROUP
Reel/Frame 022117/0887 →