Semiconductor integrated circuit device including wiring lines and interconnections
View Patent ↗Interconnections are formed over an interlayer insulating film which covers MISFETQ 1 formed on the principal surface of a semiconductor substrate, while dummy interconnections are disposed in a region spaced from such interconnections. Dummy interconnections are disposed also in a scribing area. Dummy interconnections are not formed at the peripheries of a bonding pad and a marker. In addition, a gate electrode of a MISFET and a dummy gate interconnection formed of the same layer are disposed. Furthermore, dummy regions are disposed in a shallow trench element-isolation region. After such dummy members are disposed, an insulating film is planarized by the CMP method.
1. A semiconductor integrated circuit device comprising:
trenches formed in a semiconductor substrate and defining an active region and dummy regions not functioning as an element;
element isolation insulating films filled in the trenches,
wherein the dummy regions are regularly arranged at a scribing area;
wiring lines formed over the semiconductor substrate;
dummy interconnections formed by the same level layer as the wiring lines,
wherein the dummy interconnections are regularly arranged at the scribing area;
a first interlayer insulating film formed over the wiring lines and over the dummy interconnections such that the surface of the first interlayer insulating film is flat;
an external terminal formed the over first interlayer insulating film;
a passivation film formed over the external terminal and over the first interlayer insulating film and having an opening over the external terminal;
a bump electrode formed over the passivation film and electrically connected to the external terminal through the opening; and
first interconnections formed the over first interlayer insulating film and formed by the same level layer as the external terminal,
wherein the passivation film is formed over the external terminal and over the first interconnections such that the bump electrode is formed over the first interconnections.
2. A semiconductor integrated circuit device according to claim 1 , wherein the first interconnections are comprised of dummy interconnections.
3. A semiconductor integrated circuit device according to claim 2 , wherein the dummy interconnections do not function as an element.
4. A semiconductor integrated circuit device comprising:
a trench formed in a semiconductor substrate and defining an active region and dummy regions not functioning as an element;
an element isolation insulating film filled in the trench,
wherein the dummy reciions are regularly arranged at a scribing area;
wiring lines formed over the semiconductor substrate;
dummy interconnections formed by the same level layer as the wiring lines,
wherein the dummy interconnections are reciularly arranged at the scribing area;
a first interlayer insulating film formed over the wiring lines and over the dummy interconnections such that the surface of the first interlayer insulating film is flatten;
an external terminal formed the over first interlayer insulating film;
a passivation film formed over the external terminal and over the first interlayer insulating film and having an opening over the external terminal such that a surface of the passivation film is flatten;
a bump electrode formed over the passivation film and electrically connected to the external terminal through the opening; and
first interconnections formed the over first interlayer insulating film and formed by the same level layer as the external terminal,
wherein the passivation film is formed over the external terminal and over the first interconnections such that the bump electrode is formed over the first interconnections.
5. A semiconductor integrated circuit device according to claim 4 , wherein the first interconnections are comprised of dummy interconnections.
6. A semiconductor integrated circuit device according to claim 5 , wherein the dummy interconnections do not function as an element.
7. A semiconductor integrated circuit device according to claim 4 , wherein the passivation film is formed over the external terminal and over the first interconnections such that a surface of the passivation film is flat.
8. A semiconductor integrated circuit device according to claim 1 , wherein the passivation film is formed over the external terminal and over the first interconnections such that a surface of the passivation film is flat.
9. A semiconductor integrated circuit device comprising:
a trench formed in a semiconductor substrate and defining an active region and dummy regions not functioning as an element;
an element isolation insulating film filled in the trench,
wherein the dummy regions are regularly arranged at a scribing area;
wiring lines formed over the semiconductor substrate;
dummy interconnections formed by the same level layer as the wiring lines;
wherein the dummy interconnections are regularly arranged at the scribing area;
a first interlayer insulating film formed over the wiring lines and over the dummy interconnections;
an external terminal formed the over first interlayer insulating film;
first interconnections formed the over first interlayer insulating film and formed by the same level layer as the external terminal;
a passivation film formed over the external terminal, over the first interconnections and over the first interlayer insulating film and having an opening over the external terminal; and
a bump electrode formed over the passivation film and electrically connected to the external terminal through the opening.
10. A semiconductor integrated circuit device comprising:
trenches formed in the semiconductor substrate and defining an active region and dummy regions not functioning as an element; and
element isolation insulating films filled in the trenches,
wherein the dummy regions and the first dummy interconnections are regularly arranged at a scribing area, respectively;
wiring lines formed over the semiconductor substrate;
dummy interconnections formed by the same level layer as the wiring lines,
wherein the dummy interconnections are regularly arranged at the scribing area;
a first interlaver insulating film formed over the wiring lines and over the dummy interconnections;
an external terminal formed over the first inlayer insulating film;
first interconnections formed the over first interlaver insulating film and formed by the same level layer as the external terminal;
a passivation film formed over the external terminal, over the first interconnections and over the first interlayer insulating film and having an opening over the external terminal; and
a bump electrode formed over the passivation film and electrically connected to the external terminal through the opening.
11. A semiconductor integrated circuit device according to claim 9 wherein the first interconnections are comprised of first dummy interconnections.
12. A semiconductor integrated circuit device according to claim 9 , further comprising:
a underlying film for the bump electrode formed over the first interlayer insulating film and electrically connected to the external terminal through the opening, wherein
the bump electrode is formed over the underlying film.
13. A semiconductor integrated circuit device according to claim 11 , wherein the first dummy interconnections do not function as an element.
14. A semiconductor integrated circuit device according to claim 9 , wherein the passivation film is formed over the external terminal and over the first interconnections such that a surface of the passivation film is flat.
15. A semiconductor integrated circuit device according to claim 10 , wherein the first interconnections are comprised of first dummy interconnections.
16. A semiconductor integrated circuit device according to claim 14 , wherein the first dummy interconnections do not function as an element.
17. A semiconductor integrated circuit device according to claim 10 , wherein the passivation film is formed over the external terminal and over the first interconnections such that a surface of the passivation film is flat.
18. A semiconductor integrated circuit device according to claim 10 , further comprising:
a underlying film for bump electrode formed over the first interlayer insulating film and electrically connected to the external terminal through the opening, wherein the bump electrode is formed over the underlying film.