Systems, devices and methods for thermal testing of an optoelectronic module
View Patent ↗Devices, systems and methods for thermal testing of optoelectronic modules are disclosed. The device includes a frame member, a thermoelectric cooler, a plate in thermal contact with the DUT, a heat sink in thermal contact with the frame, and a metallic clip for attaching the thermal testing device to the module (DUT). The clip secures the thermoelectric cooler to the DUT. The method includes the steps of providing a testing apparatus having a printed circuit board with a test circuit formed thereon. The test board also has an electrical interface disposed in electrical communication with the test circuit, and a thermal testing assembly. A temporary electrical connection is formed between the DUT device and the interface. The thermal testing assembly is used to maintain a test temperature of the DUT device. A data stream is transmitted through the DUT device and then evaluated for adherence to a defined specification.
1. A method for thermal testing of an optoelectronic module, the method comprising the steps of:
placing the module in a thermal testing assembly and making electrical and/or optical connections to a testing device, said thermal testing assembly comprising:
a frame;
a thermoelectric cooler in thermal contact with said frame;
a cover plate in thermal contact with the thermoelectric cooler; and
means for removably attaching the thermal testing assembly to the module;
bringing the module to a desired testing temperature;
transmitting a data stream from said testing device through the module;
evaluating said data stream against a predefined standard; and
based on the evaluation of said data stream, adjusting at least one operating parameter of the module until the module meets said predefined standard.
2. The method of claim 1 , further comprising an initial step of preheating the module to the desired testing temperature.
3. The method of claim 1 , further comprising a step for changing said test temperature and repeating said transmitting, evaluating and adjusting steps.
4. The method of claim 1 , wherein said desired testing temperature is between −40° C. and 100° C.
5. The method of claim 1 , wherein a predetermined specification associated with the optoelectronic module forms a basis for evaluating the data stream.
6. The module test system of claim 5 , wherein said predetermined standard comprises one of the following specifications: XFP MSA Specification; SONET OC-192 SR-1; SDH STM I-64.1; 10-Gigabit Ethernet; IEEE 802.3ae; 10 GBASE-LR/LW; and, 10 G Fibre Channel.
7. The method of claim 1 , wherein a bit error rate associated with the optoelectronic module forms a basis for evaluating the data stream.