Printing of multi-layer circuits
View Patent ↗The disclosure relates to circuits and methods for the manufacture of circuits, such as those which avoid the formation of undesirable short circuit paths. One such method maintains a layout area of a fluid composition receiving layer within a layout area of a dielectric layer. Another such method relates to the application of fluid composition receiving layers, conductive layers, and dielectric layers, such as in the provision of printed circuits.
1. A method for providing a printed circuit, the method comprising: ejecting a first fluid composition receiving layer adjacent to at least a portion of a surface of a substrate; ejecting a first conductive layer adjacent to at least a portion of the first receiving layer; ejecting a first dielectric layer adjacent to at least a portion of the first conductive layer; ejecting a second fluid composition receiving layer adjacent to at least a portion of the dielectric layer opposite the first conductive layer; and ejecting a second conductive layer adjacent to at least a portion of the second receiving layer.
2. The method of claim 1 , further comprising: ejecting a second dielectric layer adjacent to at least a portion of the second conductive layer; and ejecting a third fluid composition receiving layer adjacent to at least a portion of the second dielectric layer; and ejecting a third conductive layer adjacent to at least a portion of the third receiving layer.
3. The method of claim 1 , wherein the fluids for each layer are applied using a micro-fluid ejection device.
4. The method of claim 1 , further comprising drying the first receiving layer prior to ejecting the first conductive layer.
5. The method of claim 1 , further comprising ejecting a gradient layer adjacent to at least a portion of the first receiving layer prior to ejecting the first conductive layer, wherein the gradient layer is applied by substantially simultaneously ejecting a portion of a fluid used to provide the first receiving layer and a portion of a fluid used to provide the first conductive layer.
6. The method of claim 1 , further comprising heating the first conductive layer prior to application of the first dielectric layer thereto.
7. The method of claim 1 , further comprising drying the first dielectric layer prior to application of the second conductive layer thereto.
8. The method of claim 1 , further comprising drying the second receiving layer prior to application of the second conductive layer thereto.
9. The method of claim 1 , further comprising heating the second conductive layer after application thereof.