Thin-film transistor substrate, method of manufacturing the same and display apparatus having the same
View Patent ↗In a thin-film transistor (TFT) substrate, a gate insulating layer is disposed on a gate electrode electrically connected to a gate line. A semiconductor layer is disposed on the gate insulating layer. A source electrode is electrically connected to a data line that intersects the gate line. A drain electrode faces the source electrode and defines a channel area of a semiconductor layer. An organic layer is disposed on the data line and has a first opening exposing the channel area. An inorganic insulating layer is disposed on the organic layer. A pixel electrode is disposed on the inorganic insulating layer and electrically connected to the drain electrode. The inorganic insulating layer covers the first opening, and thickness of the inorganic insulating layer is substantially uniform.
1. A thin-film transistor (TFT) substrate comprising:
a substrate;
a gate electrode formed on the substrate and extended from a gate line;
a gate insulating layer formed on the substrate to cover the gate line and the gate electrode;
a semiconductor layer formed on the gate insulating layer corresponding to the gate electrode;
a source electrode formed on the semiconductor layer and extended from a data line formed on the gate insulating layer in a direction crossing a longitudinal direction of the gate line;
a drain electrode formed on the semiconductor layer opposite to the source electrode to define a channel area of the semiconductor layer between the source and drain electrodes;
an organic layer including a color filter and being formed on the gate insulating layer to cover the source electrode, the drain electrode and the data line, the organic layer having a first opening exposing the channel area;
an inorganic insulating layer formed on the color filter and an inner surface of the first opening, the inorganic insulating layer having a substantially uniform thickness; and
a pixel electrode disposed on the inorganic insulating layer, the pixel electrode directly contacting with the drain electrode through a contact hole formed in the organic layer and the inorganic layer to be electrically connected to the drain electrode, and the pixel electrode being disposed in regions except for a region in which the first opening is formed.
2. The TFT substrate of claim 1 , wherein the inorganic insulating layer comprises silicon nitride or silicon oxide.
3. The TFT substrate of claim 1 , wherein the inorganic insulating layer is formed through a deposition process at a low temperature of about 100° C. to about 250° C.
4. The TFT substrate of claim 1 , wherein the inorganic insulating layer completely covers the organic layer.
5. The TFT substrate of claim 1 , wherein the thickness of the inorganic insulating layer ranges from about 100 Å to about 2,000Å.
6. The TFT substrate of claim 1 , wherein the organic layer makes contact with at least one of the data line, the drain electrode and the gate insulating layer.
7. The TFT substrate of claim 1 , wherein the thickness of the organic layer ranges from about 2.5 μm to about 3.5 μm.
8. The TFT substrate of claim 1 , wherein the semiconductor layer overlaps the data line and the drain electrode.