IP Library Granted Patent US 8,281,219
Granted Patent B2
US 8,281,219 · App. 11/840,203 · Granted Oct 2, 2012

Error correction code (ECC) circuit test mode

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Quick Facts
Patent No.
US 8,281,219
App. No.
11/840,203
Granted
Oct 2, 2012
Kind
B2
Abstract

An ECC circuit and method for an integrated circuit memory allows a user to enter a test mode and select a specific location to force a known failure on any memory chip, whether it is fully functional or partially functional. Additional circuitry is placed in the data path where existing buffers and drivers are already located, minimizing any additional speed loss or area penalty required to implement the forced data failure. In a first general method, a logic zero is forced onto a selected data line at a given time. In a second general method, a logic one is forced onto a selected data line at a given time.

Claims (41)

1. An integrated circuit memory comprising:

a memory array coupled to an internal data line;

an ECC logic circuit for providing correct output data; and

forcing logic interposed between the internal data line and an input of the ECC logic circuit to force a specific data state on a select data bit onto the input of the ECC logic circuit when the memory array is read.

2. The integrated circuit memory of claim 1 wherein the forcing logic comprises at least one control signal input.

3. The integrated circuit memory of claim 1 wherein the forcing logic forces a logic zero onto the input of the ECC logic circuit.

4. The integrated circuit memory of claim 1 wherein the forcing logic forces a logic one onto the input of the ECC logic circuit.

5. The integrated circuit memory of claim 1 wherein the forcing logic selectively forces either a logic zero or a logic one onto the input of the ECC logic circuit.

6. The integrated circuit memory of claim 1 wherein the forcing logic comprises:

a first NAND gate having two inputs for receiving two control signals and an output;

a second NAND gate having a first input coupled to the output of the first NAND gate, a second input coupled to the internal data line, and an output; and

an inverter having an input coupled to the output of the second NAND gate and an output coupled to the input of the ECC logic circuit.

7. The integrated circuit memory of claim 6 wherein the first NAND gate comprises an additional input for receiving an additional control signal.

8. The integrated circuit memory of claim 1 wherein the forcing logic comprises:

a first NAND gate having two inputs for receiving two control signals and an output;

a second NAND gate having a first input coupled to the output of the first NAND gate, a second input, and an output coupled to the input of the ECC logic circuit; and

an inverter having an input coupled to the internal data line and an output coupled to the second input of the second NAND gate.

9. The integrated circuit memory of claim 1 wherein the forcing logic comprises:

a first logic portion capable of forcing a logic zero onto the input of the ECC logic circuit; and

a second logic portion capable of forcing a logic one onto the input of the ECC logic circuit.

10. The integrated circuit memory of claim 9 wherein the first logic portion is under control of a first control signal, and the second logic portion is under control of a second control signal.

11. An integrated circuit memory comprising:

a memory array coupled to an internal data line;

an ECC logic circuit for providing correct output data;

an ECC test circuit interposed between the internal data line and an input of the ECC logic circuit;

a test mode register; and

a predecoder coupled between the test mode register and the ECC test circuit, wherein the test mode register generates an enable signal received by the predecoder and the ECC test circuit forces a specific data state on a select data bit onto the input of the ECC logic circuit when the memory array is read.

12. The integrated circuit memory of claim 11 wherein the ECC test circuit comprises at least one control signal input.

13. The integrated circuit memory of claim 11 wherein the ECC test circuit forces a logic zero onto the input of the ECC logic circuit.

14. The integrated circuit memory of claim 11 wherein the ECC test circuit forces a logic one onto the input of the ECC logic circuit.

15. The integrated circuit memory of claim 11 wherein the ECC test circuit selectively forces either a logic zero or a logic one onto the input of the ECC logic circuit.

16. An integrated circuit memory comprising:

a memory array coupled to an internal data line;

an ECC logic circuit for providing correct output data;

an ECC test circuit interposed between the internal data line and an input of the ECC logic circuit;

a test mode register; and

a predecoder coupled between the test mode register and the ECC test circuit, wherein the test mode register generates an enable signal received directly by the ECC test circuit and the ECC test circuit forces a specific data state on a select data bit onto the input of the ECC logic circuit when the memory array is read.

17. The integrated circuit memory of claim 16 wherein the ECC test circuit comprises at least one control signal input.

18. The integrated circuit memory of claim 16 wherein the ECC test circuit forces a logic zero onto the input of the ECC logic circuit.

19. The integrated circuit memory of claim 16 wherein the ECC test circuit forces a logic one onto the input of the ECC logic circuit.

20. The integrated circuit memory of claim 16 wherein the ECC test circuit selectively forces either a logic zero or a logic one onto the input of the ECC logic circuit.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION; TESSERA ADVANCED TECHNOLOGIES, INC; DTS, INC.; DTS LLC; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
Reel/Frame 052920/0001 →
SECURITY INTEREST Recorded Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.; VEVEO, INC.; INVENSAS CORPORATION; INVENSAS BONDING TECHNOLOGIES, INC.; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
SECURITY INTEREST Recorded Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.; DIGITALOPTICS CORPORATION; DIGITALOPTICS CORPORATION MEMS; DTS, LLC; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 29, 2011
From: UNITED MEMORIES, INC.
To: INVENSAS CORPORATION
Reel/Frame 027000/0974 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 6, 2010
From: SONY CORPORATION
To: UNITED MEMORIES, INC.
Reel/Frame 024192/0736 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 16, 2007
From: PARRIS, MICHAEL C.; JONES, JR., OSCAR FREDERICK
To: UNITED MEMORIES, INC.; SONY CORPORATION
Reel/Frame 019707/0723 →