Optical component and transceiver packaging
View Patent ↗Methods of packaging a high density optical module. In one example embodiment, a method of packaging the high density optical module includes various acts. First, a first detachable fiber assembly is connected to an optical component disposed in the module such that the connection between the fiber assembly and the optical component is disposed inside a housing of the optical module. Next, the fiber included in the fiber assembly is spooled around a spooling assembly. Then, the receptacle is secured in a receptacle holder such that the receptacle is able to connect with an external fiber connector. Next, the fiber assembly is detached from the optical component. Finally, the optical component is heated such that a ball grid array connection, that connects the optical component to a high speed printed circuit board, flows such that the optical component can be removed from the high speed printed circuit board.
1. A method of packaging a high density optical module, the optical module having at least one of a receiving optical assembly and a transmitting optical assembly, the method comprising:
connecting a first detachable fiber assembly to an optical component disposed in the module such that the connection between the fiber assembly and the optical component is disposed inside a housing of the optical module, the fiber assembly including a receptacle, a fiber, and a modified connector, and the optical component comprising one of a TOSA, a ROSA, a laser, a photodiode, an optical isolator, or a polarizer;
spooling the fiber included in the fiber assembly around a spooling assembly;
securing the receptacle in a receptacle holder such that the receptacle is able to connect with an external fiber connector;
detaching the fiber assembly from the optical component; and
heating the optical component such that a ball grid array connection, that connects the optical component to a high speed printed circuit board, flows such that the optical component can be removed from the high speed printed circuit board without damaging the fiber assembly.
2. The method according to claim 1 , wherein the spooling assembly and the receptacle holder are integrated as a connection assembly.
3. The method according to claim 2 wherein the connection assembly is detachable from the housing.
4. The method according to claim 1 wherein the optical module includes an integrated circuit, the integrated circuit having a ball grid array for connection with the high speed printed circuit board.
5. The method according to claim 1 , further comprising:
replacing the optical component with a second optical component; and
connecting the fiber assembly to the second optical component.
6. The method according to claim 1 wherein the receptacle is an SC or LC receptacle.
7. The method according to claim 1 wherein the fiber has a bend radius of 7.5 mm or less.