Solid-state image pickup device and method of producing the same
View Patent ↗A solid-state image pickup device including a substrate having a first face and a second face which serves as an opposite face of the first face; a solid-state image pickup element having a plurality of electrodes and a light sensing part, an opposite face of the light sensing part being bonded to the first face via a bonding agent; a plurality of wires formed over the face, first ends of the wires serving as external electrode terminals; and a connection part for electrically connecting the electrodes to the wires, wherein an endless-shaped contraction frame formed of resin larger in thermal expansion coefficient than the substrate and image pickup element is bonded to and formed on surface of the substrate located outside the light sensing part so as to surround the light sensing part, and a light sensing face of the light sensing part is warped.
1. A solid-state image pickup device comprising:
a substrate having a first face and a second face which serves as an opposite face of the first face;
a solid-state image pickup element having a plurality of electrodes and having a light sensing part on a first face thereof, a second face of the solid-state image pickup element serving as an opposite face of the first face being bonded to the first face of the substrate via a bonding agent;
a plurality of wires formed over the first face of the substrate, first ends of the wires serving as external electrode terminals; and
connection means for electrically connecting the electrodes of the solid-state image pickup element to the wires, respectively,
wherein
a contraction frame formed of resin that is larger in thermal expansion coefficient than the substrate and the solid-state image pickup element is bonded to and formed on a surface side of the substrate located outside the light sensing part of the solid-state image pickup element so as to surround the light sensing part, and
a light sensing face of the light sensing part of the solid-state image pickup element is warped.
2. The solid-state image pickup device according to claim 1 , wherein the contraction frame takes an endless shape.
3. The solid-state image pickup device according to claim 1 , wherein the contraction frame takes a shape projected to outside of the contraction frame in a partial region thereof.
4. The solid-state image pickup device according to claim 1 , wherein
the contraction frame is formed over the face of the substrate, and
the light sensing face of the solid-state image pickup element is warped so as to take a concave shape.
5. The solid-state image pickup device according to claim 1 , wherein
the contraction frame is formed on the second face of the substrate, and
the light sensing face of the solid-state image pickup element is warped so as to take a convex shape.
6. The solid-state image pickup device according to claim 1 , wherein a material forming the solid-state image pickup element is close in thermal expansion coefficient to a material forming the substrate.
7. The solid-state image pickup device according to claim 1 , wherein
the solid-state image pickup element is formed of silicon having a thermal expansion coefficient of approximately 3 ppm/° C.,
the substrate is formed of a material having a thermal expansion coefficient of approximately 3 ppm/° C. which is close to the thermal expansion coefficient of silicon, and
the contraction frame is formed of epoxy resin having a thermal expansion coefficient of approximately 11 ppm/° C.
8. The solid-state image pickup device according to claim 1 , wherein
the electrodes of the solid-state image pickup element are connected to the wires via conductive wires, respectively, and
the wires are buried in the contraction frame.
9. The solid-state image pickup device according to claim 1 , wherein the wires are formed by bonding flexible printed circuit boards each including insulative tape and a plurality of wires provided on one face of the tape to the first face of the substrate.
10. The solid-state image pickup device according to claim 1 , wherein a transparent protection substance is bonded to whole area of the light sensing face of the solid-state image pickup element via a transparent bonding agent.