IP Library Patent Application 11840999
Patent Application
App. No. 11/840,999

FOLDED DIPOLE ANTENNA

Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US None
App. No.
11/840,999
Abstract

A folded dipole antenna that transmits and receives radio frequency waves (RF) waves has two radiating strips that form a dipole. A metallic radiating element is located between the two radiating strips, facilitating an increase in the gain of the antenna. The folded dipole antenna may be used in a wireless communication device.

Claims (25)

1 . A folded dipole antenna for at least one of transmitting and receiving radio frequency (RF) waves, the folded dipole antenna comprising:

a first radiating strip;

a second radiating strip, wherein the second radiating strip is separated from the first radiating strip by a predetermined distance, wherein the first radiating strip and the second radiating strip form a dipole; and

a metallic radiating element located between the first radiating strip and the second radiating strip.

2 . The folded dipole antenna of claim 1 , wherein the metallic radiating element is generally U-shaped.

3 . The folded dipole antenna of claim 1 , wherein a combined length of the first radiating strip and the second radiating strip is equal to about one-fourth of the wavelength of the RF waves.

4 . The folded dipole antenna of claim 1 , wherein the folded dipole antenna is a planar inverted-F antenna (PIFA).

5 . The folded dipole antenna of claim 1 , further comprising a ground plane connected to the first and second strips that is parallel to a plane of the first radiating strip, the second radiating strip and the metallic radiating element.

6 . The folded dipole antenna of claim 1 , wherein the first radiating strip, the second radiating strip, the metallic radiating element and the ground plane are formed on a printed circuit board.

7 . The folded dipole antenna of claim 1 , wherein the first and second radiating strips are mirror images of each other.

8 . A wireless communication device, comprising:

a transmitting folded dipole antenna, the transmitting folded dipole antenna comprising:

a first radiating strip;

a second radiating strip that is separated from the first radiating strip by a predetermined distance, wherein the first radiating strip and the second radiating strip form a first dipole; and

a first metallic radiating element located between the first radiating strip and the second radiating strip;

a receiving folded dipole antenna, the receiving folded dipole antenna comprising:

a third radiating strip;

a fourth radiating strip separated from the third radiating strip by a predetermined distance, wherein the third radiating strip and the fourth radiating strip form a second dipole; and

a second metallic radiating element located between the third radiating strip and the fourth radiating strip; and

a radio frequency integrated circuit (RFIC) connected to the transmitting folded dipole antenna and the receiving folded dipole antenna.

9 . The wireless communication device of claim 8 , wherein the first and second metallic radiating elements are generally U-shaped.

10 . The folded dipole antenna of claim 8 , wherein the first and second radiating strips are mirror images of each other, and the third and fourth radiating strips are mirror images of each other.

11 . The wireless communication device of claim 8 , wherein the transmitting folded dipole antenna and the receiving folded dipole antenna are laid out in a stacked structure on a printed circuit board.

12 . The wireless communication device of claim 8 , wherein the transmitting folded dipole antenna is a planar inverted-F antenna (PIFA).

13 . The wireless communication device of claim 8 , wherein the receiving folded dipole antenna is a planar inverted-F antenna (PIFA).

Assignments (7)
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0143 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0553 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0704 →
SECURITY AGREEMENT Recorded May 13, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 024397/0001 →
SECURITY AGREEMENT Recorded Mar 15, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
Reel/Frame 024085/0001 →
SECURITY AGREEMENT Recorded Feb 16, 2008
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
Reel/Frame 020518/0215 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 20, 2007
From: WONG, HANG; LUK, KWAI MAN; XUE, QUAN; CHAN, CHI HOU
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 019713/0966 →