Circuit-connecting material and circuit terminal connected structure and connecting method
View Patent ↗A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.
1. A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes, after curing by heat and pressure, either by direct contact or via conductive particles present in the material, wherein the circuit-connecting material comprises:
(1) a curing agent capable of generating free radicals upon heating;
(2) a phenoxy resin that is a hydroxyl-group-containing resin having a weight-average molecular weight of 10,000 or more; and
(3) a radical-polymerizable substance.
2. A circuit-connecting material as recited in claim 1 , wherein the circuit-connecting material includes two or more layers, wherein a first layer contains conductive particles and a second layer contains the curing agent.
3. A circuit-connecting material as recited in claim 1 , wherein the circuit-connecting material comprises conductive particles.
4. A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes, after curing by heat and pressure, either by direct contact or via conductive particles present in the material, wherein the circuit-connecting material has a modulus of elasticity of from 100 to 2000 Mpa at 40° C. after curing, wherein the circuit-connecting material comprises:
(1) a curing agent capable of generating free radicals upon heating;
(2) a phenoxy resin that is a hydroxyl-group-containing resin having a weight-average molecular weight of 10,000 or more; and
(3) a radical-polymerizable substance.
5. A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes, after curing by heat and pressure, either by direct contact or via conductive particles present in the material, wherein the circuit-connecting material comprises:
(1) a curing agent capable of generating free radicals upon heating;
(2) a hydroxyl-group-containing resin having a weight-average molecular weight of 10,000 or more, wherein the hydroxyl-group-containing resin is a phenoxy resin modified with an epoxy-group-containing elastomer; and
(3) a radical-polymerizable substance.
6. A circuit-connecting material as recited in claim 5 , wherein the circuit-connecting material includes two or more layers, wherein a first layer contains conductive particles and a second layer contains the curing agent.
7. A circuit-connecting material as recited in claim 5 , wherein the circuit-connecting material comprises conductive particles.
8. A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes, after curing by heat and pressure, either by direct contact or via conductive particles present in the material, wherein the circuit-connecting material has a modulus of elasticity of from 100 to 2000 MPa at 40° C. after curing, wherein the circuit-connecting material comprises:
(1) a curing agent capable of generating free radicals upon heating;
(2) a hydroxyl-group-containing resin having a weight-average molecular weight of 10,000 or more, wherein the hydroxyl-group-containing resin is a phenoxy resin modified with an epoxy-group-containing elastomer; and
(3) a radical-polymerizable substance.