IP Library Granted Patent US 7,910,650
Granted Patent B2
US 7,910,650 · App. 11/841,596 · Granted Mar 22, 2011

Conductive thermosets by extrusion

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,910,650
App. No.
11/841,596
Granted
Mar 22, 2011
Kind
B2
Abstract

Methods of preparing conductive thermoset precursors containing carbon nanotubes is provided. Also provided is a method of preparing conductive thermosets containing carbon nanotubes. The carbon nanotubes may in individual form or in the form of aggregates having a macromorpology resembling the shape of a cotton candy, bird nest, combed yarn or open net. Preferred multiwalled carbon nanotubes have diameters no greater than 1 micron and preferred single walled carbon nanotubes have diameters less than 5 nm. Carbon nanotubes may be adequately dispersed in a thermoset precursor by using a extrusion process generally reserved for thermoplastics. The thermoset precursor may be a precursor for epoxy, phenolic, polyimide, urethane, polyester, vinyl ester or silicone. A preferred thermoset precursor is a bisphenol A derivative.

Claims (32)

1. A method of preparing a conductive thermoset precursor comprising:

providing a first thermoset precursor having a viscosity greater than 15 poise, and

dispersing carbon nanotubes in said first thermoset precursor by extrusion to form a conductive thermoset precursor, wherein said carbon nanotubes have a diameter less than 1 micron.

2. The method of preparing the conductive thermoset precursor of claim 1 , wherein said first thermoset precursor is an epoxy precursor, phenolic precursor, polyimide precursor, urethane precursor, polyester precursor, vinyl ester precursor or silicone precursor.

3. The method of preparing the conductive thermoset precursor of claim 1 , wherein said first thermoset precursor is a bisphenol A derivative.

4. The method of preparing the conductive thermoset precursor of claim 1 , wherein the weight per epoxide in said first thermoset precursor is in the range of 600 to 4000 gram precursor/gram equivalent epoxide.

5. The method of preparing the conductive thermoset precursor of claim 1 , wherein the viscosity of said first thermoset precursor is in the range of 20 to 600 poise.

6. The method of preparing the conductive thermoset precursor of claim 1 , wherein the melting point of said first thermoset precursor is between 30 and 350° C.

7. The method of preparing the conductive thermoset precursor of claim 1 , wherein said carbon nanotubes include single walled carbon nanotubes having diameters less than 5 nanometers.

8. A method of preparing a conductive thermoset precursor comprising:

providing a first thermoset precursor having a viscosity greater than 15 poise, and

dispersing carbon nanotubes in said first thermoset precursor by extrusion to form a conductive thermoset precursor, wherein said carbon nanotubes have a diameter less than 1 micron:

wherein said carbon nanotubes are in the form of aggregates of carbon nanotubes, said aggregates having a macromorphology resembling birds nest, cotton candy, combed yarn or open net.

9. The method of preparing the conductive thermoset precursor of claim 1 , wherein said extrusion process includes the use of a co-rotating or counter rotating twin screw extruder.

10. The method of preparing the conductive thermoset precursor of claim 1 , wherein the concentration of said carbon nanotube is in the range of 0.5 to 30% by weight.

11. The method of preparing the conductive thermoset precursor of claim 1 , further comprising adding a diluting agent to the conductive thermoset precursor.

12. The method of preparing the conductive thermoset precursor of claim 11 , wherein the diluting agent is a second thermoset precursor which does not react, upon addition to the conductive thermoset precursor, with said first thermoset precursor to cure into a final thermoset product.

13. A method of preparing a conductive thermoset containing carbon nanotubes comprising:

preparing a conductive thermoset precursor by a method comprising:

providing a first thermoset precursor having a viscosity greater than 15 poise, and

dispersing carbon nanotubes in said first thermoset precursor by extrusion to form a conductive thermoset precursor, wherein said carbon nanotubes have a diameter less than 1 micron; and

reacting said conductive thermoset precursor with at least a second thermoset precursor to form a conductive thermoset, wherein:

said first thermoset precursor has a viscosity greater than 15 poise,

said second thermoset precursor has a viscosity less than said first thermoset precursor, and

said carbon nanotubes have a diameter less than 1 micron.

14. The method of claim 13 , wherein preparing the conductive thermoset precursor further comprises adding a diluting agent to the conductive thermoset precursor.

15. A conductive thermoset precursor formed by the method of claim 1 .

16. A conductive thermoset precursor formed by the method of claim 11 .

17. A conductive thermoset formed by the method of claim 13 wherein said carbon nanotubes are in the form of aggregates of carbon nanotubes, said aggregates having a macromorphology resembling birds nest, cotton candy, combed yarn or open net.

18. A conductive thermoset formed by the method of claim 14 wherein said carbon nanotubes are in the form of aggregates of carbon nanotubes, said aggregates having a macromorphology resembling birds nest, cotton candy, combed yarn or open net.

19. The conductive thermoset of claim 17 wherein said thermoset is an epoxy, polyimide, phenolic, urethane, polyester, vinyl ester or silicone polymer.

20. The conductive thermoset of claim 17 , wherein said carbon nanotubes include single walled carbon nanotubes having diameters less than 5 nanometers.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Jan 21, 2021
From: WHITE OAK GLOBAL ADVISORS, LLC, AS ADMINISTRATIVE AGENT
To: HYPERION CATALYSIS INTERNATIONAL
Reel/Frame 055058/0494 →
SECURITY AGREEMENT Recorded Sep 17, 2013
From: HYPERION CATALYSIS INTERNATIONAL
To: PDL BIOPHARMA, INC.
Reel/Frame 031227/0086 →
SECURITY AGREEMENT Recorded Aug 16, 2013
From: HYPERION CATALYSIS INTERNATIONAL
To: WHITE OAK GLOBAL ADVISORS, LLC, AS ADMINISTRATIVE AGENT
Reel/Frame 031030/0001 →