IP Library Patent Application 11842443
Patent Application
App. No. 11/842,443

SOLVENT-SOLUBLE STAMP FOR NANO-IMPRINT LITHOGRAPHY AND METHOD OF MANUFACTURING THE SAME

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Patent No.
US None
App. No.
11/842,443
Abstract

A method of manufacturing a solvent-soluble stamp for nano-imprint lithography is provided. According to the method, a stamp is formed on a master substrate made of an ultraviolet-transparent material, using a material which is soluble in a solvent, and then a metal stamp or another stamp for a nano-imprint lithography is manufactured using the solvent-soluble stamp. Next, the stamp for nano-imprint lithography can be achieved by melting the soluble stamp. Therefore, it is possible to reuse the master several times. Further, it is possible to solve a problem in which a mold cannot be separated from the stamp. Furthermore, a uniform and clean stamp with a nano size can be obtained.

Claims (20)

1 . A method of manufacturing a solvent-soluble stamp for nano-imprint lithography, the method comprising:

(a) forming a pattern on the upper surface of a substrate using a lithography process after a resist is coated on the upper surface of the substrate;

(b) etching the substrate using the patterned resist;

(c) vapor-depositing a polymer on the structure in step (b);

(d) physically separating the polymer on which the pattern of the substrate is lithographed from the substrate;

(e) vapor-depositing a metal layer for plating on the upper surface of the separated polymer pattern using a sputtering process;

(f) vapor-depositing a metal on the upper surface of the structure in step (e) by electroplating method; and

(g) solving the structure in step (f) in the solvent to remove the polymer, so as to obtain the stamp for nano-imprint lithography.

2 . A method of manufacturing a solvent-soluble stamp for nano-imprint lithography, the method comprising:

(a) forming a pattern on the upper surface of a substrate using a lithography process after a resist is coated on the upper surface of the substrate;

(b) etching the substrate using the patterned resist;

(c) vapor-depositing a polymer such as solvent-soluble resin on the structure in step (b); and

(d) physically separating the polymer on which the pattern of the substrate is lithographed from the substrate, so as to obtain the stamp for nano-imprint lithography.

3 . The method as claimed in claim 1 , wherein the substrate is made from an ultraviolet-permeable material selected from silicon Si, glass, quartz, sapphire, and diamond.

4 . The method as claimed in claim 2 , wherein the substrate is made from an ultraviolet-permeable material selected from silicon Si, glass, quartz, sapphire, and diamond.

5 . The method as claimed in claim 1 , wherein the metal deposited on the structure in step (f) includes nickel Ni and copper Cu.

6 . The method as claimed in claim 1 , wherein etching the substrate using the patterned resist includes using the patterned resist as an etching barrier.

7 . The method as claimed in claim 1 , wherein the polymer is a solvent soluble resin.

8 . The method as claimed in claim 2 , wherein etching the substrate using the patterned resist includes using the patterned resist as an etching barrier.

9 . The method as claimed in claim 2 , wherein the polymer is a solvent soluble resin.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE ERRONEOUSLY FILED NO. 7255478 FROM SCHEDULE PREVIOUSLY RECORDED AT REEL: 028153 FRAME: 0689. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Oct 5, 2016
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 040001/0920 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 3, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SEAGATE TECHNOLOGY INTERNATIONAL
Reel/Frame 028153/0689 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 21, 2007
From: LEE, BYUNG KYU; LEE, MYUNG BOK; SOHN, JIN SEUNG; LEE, DU HYUN; CHO, EUN HYUNG; KIM, HAE SUNG
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 019723/0914 →