SYSTEM AND METHOD FOR MEASURING ADHESION FORCES IN MEMS DEVICES

1 . An array of MEMS devices, comprising:

an optical stack located over a substrate, the optical stack comprising apartially reflective layer;

an array of flexible beams spaced apart from the optical stack by an air gap, wherein application of a voltage across said beams and said optical stack is inhibited; and

reflective surfaces positioned on the side of the beams facing the optical stack, wherein sustained adhesion of particular beams to the optical stack is indicative of non-electrostatic adhesion forces within the MEMS device.

2 . The array of claim 1 , wherein the height of the air gap varies in the array.

3 . The array of claim 2 , additionally comprising a plurality of support posts supporting the flexible beams, wherein the support posts comprise outwardly extending wing portions, and wherein the size of the outwardly extending wing portions varies in the array.

4 . The array of claim 1 , additionally comprising a conductive via extending between conductive portions of the flexible beam and conductive portions of the optical stack.

5 . A method of fabricating an array of test devices, comprising:

forming an optical stack over a substrate, the optical stack comprising a partially reflective layer; and

forming a plurality of beams spaced apart from the substrate by an air gap, wherein the beams are not electrostatically actuatable towards the optical stack, and wherein the beams comprise a reflective surface facing the optical stack.

6 . The method of claim 5 , the method additionally comprising forming a plurality of conductive vias, each via extending between a conductive portion of the optical stack and a conductive portion of one of the plurality of beams.

7 . The method of claim 5 , wherein the height of the air gap varies in the array.

8 . The method of claim 7 , additionally comprising forming a plurality of support structures, wherein the plurality of support structures comprise outwardly extending wing portions, and wherein the size of the wing portions varies in the array.

9 . A method of testing an array of MEMS devices, comprising:

providing an array of beams spaced apart from an optical stack by an air gap, wherein the beams comprise a reflective layer on their lower surface and have a stiffness that varies across the array, and wherein the optical stack comprises a partially reflective layer and a lower electrode;

determining a predicted actuation voltage for each of the array of beams;

applying a first voltage between the array of beams and the lower electrode;

determining, without the aid of an external interferometer, which of the array of beams have been actuated through the air gap towards the electrode due to application of the first voltage; and

comparing the first voltage with the predicted actuation voltages for each of the beams.

10 . The method of claim 9 , additionally comprising:

applying a second voltage between the array of beams and the electrode; and

determining, without the aid of an external interferometer, which of the array of beams have been actuated through the air gap towards the electrode due to application of the second voltage; and

comparing the second voltage with the predicted actuation voltages for each of the beams.

11 . The method of claim 9 , additionally comprising:

providing a second array of beams spaced apart from an optical stack by an air gap, wherein the beams comprise a reflective layer on their lower surface and have a stiffness that varies across the second array;

determining a predicted actuation voltage for each of the second array of beams;

applying said first voltage across the second array of beams and the second electrode;

determining, without the aid of an external interferometer, which of the second array of beams have been actuate through the air gap towards the electrode due to application of the first voltage; and

comparing the second voltage with the predicted actuation voltage for each of the array of beams.

12 . The method of claim 9 , wherein the second array of beams are oriented in a different direction than the first array of beams.

13 . The method of claim 9 , additionally comprising determining the height of the air gap prior to applying said first voltage.

14 . The method of claim 9 , wherein determining which of the array of beams have been actuated comprises determining the wavelength of the light reflected by the MEMS devices.

15 . The method of claim 9 , wherein determining which of the array of beams have been actuated comprises determining the capacitance of the MEMS devices.

16 . A method of testing an array of MEMS devices, comprising:

providing an array of beams having a reflective layer on their lower surface, wherein said beams are spaced apart from a partially reflective layer and a first electrode by an air gap, wherein the stiffness of the beams varies across a length of the array;

applying a first voltage between the array of beams and the first electrode sufficient to cause each of the plurality of beams to actuate through the air gap and come into contact with an underlying layer;

releasing the first voltage;

determining, without the aid of an external interferometer, which of the array of beams remain unreleased; and

determining the adhesion energy holding the unreleased beams in place.

17 . The method of claim 16 , additionally comprising

calculating a restoring force of the stiffest unreleased beam; and

utilizing the calculated restoring force to determine the adhesion energy.

18 . The method of claim 16 , wherein applying a first voltage comprises applying a cyclical voltage for a predetermined period of time.

19 . The method of claim 16 , additionally comprising determining the height of the air gap prior to applying said first voltage.

20 . The method of claim 16 , wherein determining which of the array of beams have been actuated comprises determining the wavelength of the light reflected by the MEMS devices.

21 . The method of claim 16 , wherein determining which of the array of beams have been actuated comprises determining the capacitance of the MEMS devices.

22 . A method of testing an array of MEMS devices, comprising:

providing an array of beams having a reflective contact area on their lower surface, wherein said beams are spaced apart from a partially reflective layer and a first electrode by an air gap, wherein the size of the contact area varies across a length of the array;

applying a first voltage between the array of beams and the first electrode sufficient to cause each of the plurality of beams to actuate through the air gap and come into contact with an underlying layer;

releasing the first voltage;

determining, without the aid of an external interferometer, which of the array of beams remain unreleased; and

determining the adhesion energy holding the unreleased beams in place.

23 . The method of claim 22 , additionally comprising

determining a restoring force of the unreleased beam having the largest contact area; and

determining adhesion energy using the restoring force.

24 . The method of claim 22 , additionally comprising determining the height of the air gap prior to applying said first voltage.

25 . The method of claim 22 , wherein determining which of the array of beams have been actuated comprises determining the wavelength of the light reflected by the MEMS devices.

26 . The method of claim 22 , wherein determining which of the array of beams have been actuated comprises determining the capacitance of the MEMS devices.

27 . A method of testing an array of MEMS devices, comprising:

providing an array of beams spaced apart from a lower electrode by an air gap, wherein the beams comprise a conductive portion and have a stiffness that varies across the array;

determining a predicted actuation energy for each of the array of beams;

applying a first voltage between the array of beams and the lower electrode;

determining, based on the electrical characteristics of the MEMS devices, which of the array of beams have been actuated through the air gap towards the electrode due to application of the first voltage; and

comparing the first voltage with the predicted actuation voltages for each of the beams.

28 . The method of claim 27 , wherein determining which of the array of beams have been actuated comprises determining the capacitance of the MEMS devices.

29 . A method of testing an array of MEMS devices, comprising:

providing an array of beams spaced apart from a partially reflective layer and a first electrode by an air gap, wherein the stiffness of the beams varies across a length of the array;

applying a first voltage between the array of beams and the first electrode sufficient to cause each of the plurality of beams to actuate through the air gap and come into contact with an underlying layer;

releasing the first voltage;

determining, based on the electrical characteristics of the MEMS devices, which of the array of beams remain unreleased; and

determining the adhesion energy holding the unreleased beams in place.

30 . The method of claim 29 wherein determining which of the array of beams remain unreleased comprises determining the capacitance of the MEMS devices.

31 . A method of testing an array of MEMS devices, comprising:

providing an array of beams having a contact area on their lower surface, wherein said beams are spaced apart from a first electrode by an air gap, and wherein the size of the contact area varies across a length of the array;

applying a first voltage between the array of beams and the first electrode sufficient to cause each of the plurality of beams to actuate through the air gap and come into contact with an underlying layer;

releasing the first voltage;

determining, based on the electrical characteristics of the MEMS devices, which of the array of beams remain unreleased; and

determining the adhesion energy holding the unreleased beams in place.

32 . The method of claim 31 , wherein determining which of the array of beams remain unreleased comprises determining the capacitance of the MEMS devices.

33 . An array of MEMS devices, comprising:

means for reflecting incident light;

means for partially reflecting incident light;

means for inhibiting the application of a voltage between said reflecting means and said partially reflecting means; and

means for restoring said reflecting means to positions away from said partially reflecting means, wherein the restoration of particular reflecting means is indicative of non-electrostatic adhesion forces within the MEMS device.

34 . A computer readable medium, comprising instructions for testing an array of MEMS devices, the instructions comprising:

instructions for applying a voltage across an array of test structures, wherein the test structures comprise integrated interferometric modulators; and

instructions for determining which of the test structures have actuated.

35 . A computer readable medium, comprising instructions for testing an array of MEMS devices, the instructions comprising:

instructions for applying a time-varying voltage across an array of test structures for a predetermined time period, wherein the test structures comprise integrated interferometric modulators; and

instructions for determining which of the test structures have returned to an unactuated state.